SLASEH4 November   2023 DAC61401 , DAC81401

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements: Write, IOVDD: 1.7 V to 2.7 V
    7. 5.7  Timing Requirements: Write, IOVDD: 2.7 V to 5.5 V
    8. 5.8  Timing Requirements: Read and Daisy Chain, FSDO = 0, IOVDD: 1.7 V to 2.7 V
    9. 5.9  Timing Requirements: Read and Daisy Chain, FSDO = 1, IOVDD: 1.7 V to 2.7 V
    10. 5.10 Timing Requirements: Read and Daisy Chain, FSDO = 0, IOVDD: 2.7 V to 5.5 V
    11. 5.11 Timing Requirements: Read and Daisy Chain, FSDO = 1, IOVDD: 2.7 V to 5.5 V
    12. 5.12 Timing Diagrams
    13. 5.13 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Digital-to-Analog Converter (DAC) Architecture
      2. 6.3.2 R-2R Ladder DAC
      3. 6.3.3 Programmable Gain Output Buffer
      4. 6.3.4 Sense Pins
      5. 6.3.5 DAC Register Structure
        1. 6.3.5.1 Output Update
        2. 6.3.5.2 Software Clear
          1. 6.3.5.2.1 Software Reset Mode
      6. 6.3.6 Internal Reference
      7. 6.3.7 Power-Supply Sequence
        1. 6.3.7.1 Power-On Reset (POR)
      8. 6.3.8 Thermal Alarm
    4. 6.4 Device Functional Modes
      1. 6.4.1 Power Down Mode
    5. 6.5 Programming
      1. 6.5.1 Stand-Alone Operation
      2. 6.5.2 Daisy-Chain Operation
      3. 6.5.3 Frame Error Checking
  8. 7 Register Map
    1. 7.1 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Key Components
        2. 8.2.2.2 Compensation Capacitor
        3. 8.2.2.3 Gain Stage
        4. 8.2.2.4 Attenuation and Buffer Stage
        5. 8.2.2.5 External Power Supply
        6. 8.2.2.6 Protection Design
        7. 8.2.2.7 Design Accuracy
      3. 8.2.3 Application Curves
    3. 8.3 Initialization Set Up
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3.8 Thermal Alarm

The device incorporates a thermal shutdown that is triggered when the die temperature exceeds 140°C. A thermal shutdown sets the TEMP-ALM bit in the STATUS register, and causes the DAC output to power-down. However, the internal reference remains powered on. The FAULT pin can be configured to monitor a thermal shutdown condition by setting the TEMPALM-EN bit in the SPICONFIG register. After a thermal shutdown is triggered, the device stays in shutdown even after the device temperature lowers.

The die temperature must fall to less than 140°C before the device can be returned to normal operation. To resume normal operation, the thermal alarm must be cleared through the ALM-RESET bit in the TRIGGER register while the DAC channel is in power-down mode.