SLASEH4A November   2023  – December 2024 DAC61401 , DAC81401

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements - Write, IOVDD = 1.7V to 2.7V
    7. 5.7  Timing Requirements - Write, IOVDD = 2.7V to 5.5V
    8. 5.8  Timing Requirements - Read and Daisy Chain, FSDO = 0, IOVDD = 1.7V to 2.7V
    9. 5.9  Timing Requirements - Read and Daisy Chain, FSDO = 1, IOVDD = 1.7V to 2.7V
    10. 5.10 Timing Requirements - Read and Daisy Chain, FSDO = 0, IOVDD = 2.7V to 5.5V
    11. 5.11 Timing Requirements - Read and Daisy Chain, FSDO = 1, IOVDD = 2.7V to 5.5V
    12. 5.12 Timing Diagrams
    13. 5.13 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Digital-to-Analog Converter (DAC) Architecture
      2. 6.3.2 R-2R Ladder DAC
      3. 6.3.3 Programmable Gain Output Buffer
      4. 6.3.4 Sense Pins
      5. 6.3.5 DAC Register Structure
        1. 6.3.5.1 Output Update
        2. 6.3.5.2 Software Clear
          1. 6.3.5.2.1 Software Reset Mode
      6. 6.3.6 Internal Reference
      7. 6.3.7 Power-Supply Sequence
        1. 6.3.7.1 Power-On Reset (POR)
      8. 6.3.8 Thermal Alarm
    4. 6.4 Device Functional Modes
      1. 6.4.1 Power Down Mode
    5. 6.5 Programming
      1. 6.5.1 Stand-Alone Operation
      2. 6.5.2 Daisy-Chain Operation
      3. 6.5.3 Frame Error Checking
  8. Register Map
    1. 7.1 Registers
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Key Components
        2. 8.2.2.2 Compensation Capacitor
        3. 8.2.2.3 Gain Stage
        4. 8.2.2.4 Attenuation and Buffer Stage
        5. 8.2.2.5 External Power Supply
        6. 8.2.2.6 Protection Design
        7. 8.2.2.7 Design Accuracy
      3. 8.2.3 Application Curves
    3. 8.3 Initialization Set Up
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Examples
  10. Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Layout Guidelines

Printed circuit board (PCB) layout plays a significant role in achieving desired ac and dc performance from the device and this kind of precision analog component requires careful layout, adequate bypassing, and clean, well-regulated power supplies. As a general rule, place digital traces as far away from analog traces as possible.

Place bypass capacitor and additional capacitor close to the device. The recommended capacitors for this device are listed below:

  • 0.1µF capacitor close to the device and another 1µF to 10µF capacitor for AVDD
  • 0.1µF capacitor close to the device and another 1µF to 10µF capacitor for AVSS
  • 0.1µF capacitor close to the device and another 1µF to 10µF capacitor for VDD
  • 0.1µF capacitor close to the device and another 1µF capacitor (optional) for IOVDD
  • 0.15µF capacitor at VREFIO pin for internal reference noise filtering

For best power-supply bypassing, place the bypass capacitors close to the respective power-supply pins. Provide unbroken ground reference planes for the digital signal traces, especially for the SPI signals. The FAULT signal is static line; therefore, this line can lay on the analog side of the ground plane. Figure 8-8 and Figure 8-9 show example layouts.