SLASEH4A November   2023  – December 2024 DAC61401 , DAC81401

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements - Write, IOVDD = 1.7V to 2.7V
    7. 5.7  Timing Requirements - Write, IOVDD = 2.7V to 5.5V
    8. 5.8  Timing Requirements - Read and Daisy Chain, FSDO = 0, IOVDD = 1.7V to 2.7V
    9. 5.9  Timing Requirements - Read and Daisy Chain, FSDO = 1, IOVDD = 1.7V to 2.7V
    10. 5.10 Timing Requirements - Read and Daisy Chain, FSDO = 0, IOVDD = 2.7V to 5.5V
    11. 5.11 Timing Requirements - Read and Daisy Chain, FSDO = 1, IOVDD = 2.7V to 5.5V
    12. 5.12 Timing Diagrams
    13. 5.13 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Digital-to-Analog Converter (DAC) Architecture
      2. 6.3.2 R-2R Ladder DAC
      3. 6.3.3 Programmable Gain Output Buffer
      4. 6.3.4 Sense Pins
      5. 6.3.5 DAC Register Structure
        1. 6.3.5.1 Output Update
        2. 6.3.5.2 Software Clear
          1. 6.3.5.2.1 Software Reset Mode
      6. 6.3.6 Internal Reference
      7. 6.3.7 Power-Supply Sequence
        1. 6.3.7.1 Power-On Reset (POR)
      8. 6.3.8 Thermal Alarm
    4. 6.4 Device Functional Modes
      1. 6.4.1 Power Down Mode
    5. 6.5 Programming
      1. 6.5.1 Stand-Alone Operation
      2. 6.5.2 Daisy-Chain Operation
      3. 6.5.3 Frame Error Checking
  8. 7 Register Map
    1. 7.1 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Key Components
        2. 8.2.2.2 Compensation Capacitor
        3. 8.2.2.3 Gain Stage
        4. 8.2.2.4 Attenuation and Buffer Stage
        5. 8.2.2.5 External Power Supply
        6. 8.2.2.6 Protection Design
        7. 8.2.2.7 Design Accuracy
      3. 8.2.3 Application Curves
    3. 8.3 Initialization Set Up
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Examples
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3 Initialization Set Up

To check the basic functionality and working of the DACx1401, follow the steps as described here:

  • Power up the device with supply values AVDD = 15V, AVSS = –15V, VDD = 5V and IOVDD = 3.3V (these are just recommendation and can be different as per device operating conditions)

  • Write SPI frame in the following sequence:
    • Write 0x0A04 to the SPI_CONFIG (0x03) register to power up the device
    • Write 0x0000 to the GEN_CONFIG (0x04) register to power up the internal reference
    • Write 0xFFFE to the DAC_PWDWN (0x09) register to power up the DAC output
    • Write 0x0005 to the DACRANGE (0x0A) register to configure the DAC in ±5V range, default output range is 0V to 5V
    • Write 0x0000, 0x7FFF or 0xFFFF to the DAC (0x10) register to configure the DACx1401 VOUT to 2.5V, 0V, or 2.5V