SLASEH2A November   2020  – May 2021 DAC61404 , DAC81404

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Timing Requirements: Write, IOVDD: 1.7 V to 2.7 V
    7. 7.7  Timing Requirements: Write, IOVDD: 2.7 V to 5.5 V
    8. 7.8  Timing Requirements: Read and Daisy Chain, FSDO = 0, IOVDD: 1.7 V to 2.7 V
    9. 7.9  Timing Requirements: Read and Daisy Chain, FSDO = 1, IOVDD: 1.7 V to 2.7 V
    10. 7.10 Timing Requirements: Read and Daisy Chain, FSDO = 0, IOVDD: 2.7 V to 5.5 V
    11. 7.11 Timing Requirements: Read and Daisy Chain, FSDO = 1, IOVDD: 2.7 V to 5.5 V
    12. 7.12 Timing Diagrams
    13. 7.13 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 R-2R Ladder DAC
      2. 8.3.2 Programmable-Gain Output Buffer
        1. 8.3.2.1 Sense Pins
      3. 8.3.3 DAC Register Structure
        1. 8.3.3.1 DAC Output Update
          1. 8.3.3.1.1 Synchronous Update
          2. 8.3.3.1.2 Asynchronous Update
        2. 8.3.3.2 Broadcast DAC Register
        3. 8.3.3.3 Clear DAC Operation
      4. 8.3.4 Internal Reference
      5. 8.3.5 Power-On Reset (POR)
        1. 8.3.5.1 Hardware Reset
        2. 8.3.5.2 Software Reset
      6. 8.3.6 Thermal Alarm
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Mode
    5. 8.5 Programming
      1. 8.5.1 Stand-Alone Operation
      2. 8.5.2 Daisy-Chain Operation
      3. 8.5.3 Frame Error Checking
    6. 8.6 Register Map
      1. 8.6.1  NOP Register (address = 00h) [reset = 0000h]
      2. 8.6.2  DEVICEID Register (address = 01h) [reset = 0A60h or 0920h]
      3. 8.6.3  STATUS Register (address = 02h) [reset = 0000h]
      4. 8.6.4  SPICONFIG Register (address = 03h) [reset = 0AA4h]
      5. 8.6.5  GENCONFIG Register (address = 04h) [reset = 4000h]
      6. 8.6.6  BRDCONFIG Register (address = 05h) [reset = 000Fh]
      7. 8.6.7  SYNCCONFIG Register (address = 06h) [reset = 0000h]
      8. 8.6.8  DACPWDWN Register (address = 09h) [reset = FFFFh]
      9. 8.6.9  DACRANGE Register (address = 0Ah) [reset = 0000h]
      10. 8.6.10 TRIGGER Register (address = 0Eh) [reset = 0000h]
      11. 8.6.11 BRDCAST Register (address = 0Fh) [reset = 0000h]
      12. 8.6.12 DACn Register (address = 10h to 13h) [reset = 0000h]
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Power Supply Recommendations

The device requires four power-supply inputs: IOVDD, DVDD, AVDD, and AVSS. A 0.1-µF ceramic capacitor must be connected close to each power-supply pin. In addition, a 4.7-µF or 10-µF bulk capacitor is recommended for each power supply. Tantalum or aluminum types can be chosen for the bulk capacitors.

There is no sequencing requirement for the power supplies. The DAC output range is configurable; therefore, sufficient power-supply headroom is required to achieve linearity at codes close to the power-supply rails. When sourcing or sinking current from or to the DAC output, make sure to account for the effects of power dissipation on the temperature of the device, and ensure the device does not exceed the maximum junction temperature.