SLAS950A May   2013  – June 2015 DAC7562-Q1 , DAC7563-Q1 , DAC8162-Q1 , DAC8163-Q1 , DAC8562-Q1 , DAC8563-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
      1. 7.7.1 Tables of Graphs
      2. 7.7.2 Internal Reference
      3. 7.7.3 DAC at AVDD = 5.5 V
      4. 7.7.4 Typical Characteristics: DAC at AVDD = 3.6 V
      5. 7.7.5 Typical Characteristics: DAC at AVDD = 2.7 V
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Digital-to-Analog Converter (DAC)
        1. 8.3.1.1 Resistor String
        2. 8.3.1.2 Output Amplifier
      2. 8.3.2 Internal Reference
      3. 8.3.3 Power-On Reset
        1. 8.3.3.1 Power-On Reset to Zero-Scale
        2. 8.3.3.2 Power-On Reset to Mid-Scale
        3. 8.3.3.3 Power-On Reset (POR) Levels
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Modes
        1. 8.4.1.1 DAC Power-Down Commands
      2. 8.4.2 Gain Function
      3. 8.4.3 Software Reset Function
      4. 8.4.4 Internal Reference Enable Register
        1. 8.4.4.1 Enabling Internal Reference
        2. 8.4.4.2 Disabling Internal Reference
      5. 8.4.5 CLR Functionality
      6. 8.4.6 LDAC Functionality
    5. 8.5 Programming
      1. 8.5.1 SYNC Interrupt
      2. 8.5.2 DAC Register Configuration
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 DAC Internal Reference
        1. 9.1.1.1 Supply Voltage
        2. 9.1.1.2 Temperature Drift
        3. 9.1.1.3 Noise Performance
        4. 9.1.1.4 Load Regulation
          1. 9.1.1.4.1 Long-Term Stability
        5. 9.1.1.5 Thermal Hysteresis
      2. 9.1.2 DAC Noise Performance
    2. 9.2 Typical Applications
      1. 9.2.1 Combined Voltage and Current Analog Output Module Using the XTR300
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Up to ±15-V Bipolar Output Using the DAC8562-Q1
    3. 9.3 System Examples
      1. 9.3.1 MSP430 Microprocessor Interfacing
      2. 9.3.2 TMS320 McBSP Microprocessor Interfacing
      3. 9.3.3 OMAP-L1x Processor Interfacing
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Community Resource
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Documentation Support

12.1.1 Related Documentation

For related documentation see the following:

  • DAC7562EVM, DAC8562EVM User's Guide (SBAU183) or go to either of the following tool folders:
  • MSP430F2013, MIXED SIGNAL MICROCONTROLLER (SLAS491)
  • OMAP-L138 C6000™ DSP+ ARM® Processor (SPRS586)
  • TMS320F2806x Piccolo™ Microcontrollers (SPRS698)
  • XTR111, Precision Voltage-to-Current Converter/Transmitter (SBOS375)

12.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 18. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
DAC8562-Q1 Click here Click here Click here Click here Click here
DAC8563-Q1 Click here Click here Click here Click here Click here
DAC8162-Q1 Click here Click here Click here Click here Click here
DAC8163-Q1 Click here Click here Click here Click here Click here
DAC7562-Q1 Click here Click here Click here Click here Click here
DAC7563-Q1 Click here Click here Click here Click here Click here

12.3 Community Resource

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.4 Trademarks

E2E is a trademark of Texas Instruments.

SPI, QSPI are trademarks of Motorola, Inc.

All other trademarks are the property of their respective owners.

12.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.