SLAS464C December   2006  – January 2018 DAC8560

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Functional Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements
    7. 6.7  Typical Characteristics: Internal Reference
    8. 6.8  Typical Characteristics: DAC at VDD = 5 V
    9. 6.9  Typical Characteristics: DAC at VDD = 3.6 V
    10. 6.10 Typical Characteristics: DAC at VDD = 2.7 V
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital-to-Analog Converter (DAC)
      2. 7.3.2 Resistor String
      3. 7.3.3 Output Amplifier
      4. 7.3.4 DAC Noise Performance
      5. 7.3.5 Internal Reference
        1. 7.3.5.1 Enable/Disable Internal Reference
        2. 7.3.5.2 Internal Reference Load
          1. 7.3.5.2.1 Supply Voltage
          2. 7.3.5.2.2 Temperature Drift
          3. 7.3.5.2.3 Noise Performance
          4. 7.3.5.2.4 Load Regulation
          5. 7.3.5.2.5 Long-Term Stability
          6. 7.3.5.2.6 Thermal Hysteresis
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-Down Modes
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
      2. 7.5.2 Input Shift Register
      3. 7.5.3 SYNC Interrupt
      4. 7.5.4 Power-On Reset
    6. 7.6 Register Maps
      1. 7.6.1 Write Sequence for Disabling the DAC8560 Internal Reference
        1. Table 1. Write Sequence for Disabling the DAC8560 Internal Reference
      2. 7.6.2 Enabling the DAC8560 Internal Reference (Write Sequence 1 of 2)
        1. Table 2. Enabling the DAC8560 Internal Reference (Write Sequence 1 of 2)
      3. 7.6.3 Enabling the DAC8560 Internal Reference (Write Sequence 2 of 2)
        1. Table 3. Enabling the DAC8560 Internal Reference (Write Sequence 2 of 2)
      4. 7.6.4 DAC8560 Data Input Register Format
        1. Table 4. DAC8560 Data Input Register Format
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure or Bipolar Operation > ±VREF
        1. 8.2.2.1 Bipolar Operation Greater Than ±VREF
          1. 8.2.2.1.1 Passive Component Selection
          2. 8.2.2.1.2 Amplifier Selection
        2. 8.2.2.2 Microprocessor Interfacing
          1. 8.2.2.2.1 DAC8560 to 8051 Interface
          2. 8.2.2.2.2 DAC8560 to Microwire Interface
          3. 8.2.2.2.3 DAC8560 to 68HC11 Interface
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resource
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5.1 Serial Interface

The DAC8560 has a 3-wire serial interface ( SYNC, SCLK, and DIN) that is compatible with SPI, QSPI, and Microwire interface standards, as well as most DSPs. See Figure 1 for an example of a typical write sequence.

The write sequence begins by bringing the SYNC line LOW. Data from the DIN line is clocked into the 24-bit shift register on each falling edge of SCLK. The serial clock frequency can be as high as 30 MHz, making the DAC8560 compatible with high-speed DSPs. On the 24th falling edge of the serial clock, the last data bit is clocked in and the programmed function is executed.

At this point, the SYNC line may be kept LOW or brought HIGH. In either case, it must be brought HIGH for a minimum of 33 ns before the next write sequence so that a falling edge of SYNC can initiate the next write sequence. As previously mentioned, it must be brought HIGH again before the next write sequence.