SLAS950A May   2013  – June 2015 DAC7562-Q1 , DAC7563-Q1 , DAC8162-Q1 , DAC8163-Q1 , DAC8562-Q1 , DAC8563-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
      1. 7.7.1 Tables of Graphs
      2. 7.7.2 Internal Reference
      3. 7.7.3 DAC at AVDD = 5.5 V
      4. 7.7.4 Typical Characteristics: DAC at AVDD = 3.6 V
      5. 7.7.5 Typical Characteristics: DAC at AVDD = 2.7 V
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Digital-to-Analog Converter (DAC)
        1. 8.3.1.1 Resistor String
        2. 8.3.1.2 Output Amplifier
      2. 8.3.2 Internal Reference
      3. 8.3.3 Power-On Reset
        1. 8.3.3.1 Power-On Reset to Zero-Scale
        2. 8.3.3.2 Power-On Reset to Mid-Scale
        3. 8.3.3.3 Power-On Reset (POR) Levels
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Modes
        1. 8.4.1.1 DAC Power-Down Commands
      2. 8.4.2 Gain Function
      3. 8.4.3 Software Reset Function
      4. 8.4.4 Internal Reference Enable Register
        1. 8.4.4.1 Enabling Internal Reference
        2. 8.4.4.2 Disabling Internal Reference
      5. 8.4.5 CLR Functionality
      6. 8.4.6 LDAC Functionality
    5. 8.5 Programming
      1. 8.5.1 SYNC Interrupt
      2. 8.5.2 DAC Register Configuration
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 DAC Internal Reference
        1. 9.1.1.1 Supply Voltage
        2. 9.1.1.2 Temperature Drift
        3. 9.1.1.3 Noise Performance
        4. 9.1.1.4 Load Regulation
          1. 9.1.1.4.1 Long-Term Stability
        5. 9.1.1.5 Thermal Hysteresis
      2. 9.1.2 DAC Noise Performance
    2. 9.2 Typical Applications
      1. 9.2.1 Combined Voltage and Current Analog Output Module Using the XTR300
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Up to ±15-V Bipolar Output Using the DAC8562-Q1
    3. 9.3 System Examples
      1. 9.3.1 MSP430 Microprocessor Interfacing
      2. 9.3.2 TMS320 McBSP Microprocessor Interfacing
      3. 9.3.3 OMAP-L1x Processor Interfacing
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Community Resource
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from * Revision (May 2013) to A Revision

  • Changed Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Released the DAC8563-Q1, DAC8162-Q1, DAC8163-Q1, DAC7562-Q1, and DAC7563-Q1 devicesGo
  • Added the code-change total glitch amplitude parameter to the Electrical Characteristics table Go