SBVS014C August   2000  – August 2021 DCV010505 , DCV010505D , DCV010512 , DCV010512D , DCV010515 , DCV010515D , DCV011512D , DCV011515D , DCV012405 , DCV012415D

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1  Isolation
        1. 8.3.1.1 Operation or Functional Isolation
        2. 8.3.1.2 Basic or Enhanced Isolation
        3. 8.3.1.3 Working Voltage
        4. 8.3.1.4 Isolation Voltage Rating
        5. 8.3.1.5 Repeated High-Voltage Isolation Testing
      2. 8.3.2  Power Stage
      3. 8.3.3  Oscillator and Watchdog Circuit
      4. 8.3.4  Thermal Shutdown
      5. 8.3.5  Synchronization
      6. 8.3.6  Light Load Operation (< 10%)
      7. 8.3.7  Load Regulation (10% to 100%)
      8. 8.3.8  Construction
      9. 8.3.9  Thermal Management
      10. 8.3.10 Power-Up Characteristics
    4. 8.4 Device Functional Modes
      1. 8.4.1 Disable and Enable (SYNCIN Pin)
      2. 8.4.2 Decoupling
        1. 8.4.2.1 Ripple Reduction
        2. 8.4.2.2 Connecting the DCV01 in Series
        3. 8.4.2.3 Connecting the DCV01 in Parallel
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input Capacitor
        2. 9.2.2.2 Output Capacitor
        3. 9.2.2.3 SYNCIN Pin
        4. 9.2.2.4 PCB Design
        5. 9.2.2.5 Decoupling Ceramic Capacitors
        6. 9.2.2.6 Input Capacitor and the Effects of ESR
        7. 9.2.2.7 Ripple and Noise
          1. 9.2.2.7.1 Output Ripple Calculation Example
        8. 9.2.2.8 Dual DCV01 Output Voltage
        9. 9.2.2.9 Optimizing Performance
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.2.4 PCB Design

The copper losses (resistance and inductance) can be minimized by using wide ground and power traces or planes. If several devices are being powered from a common power source, a star-connected layout must be used. Device inputs must not be connected in series, as this will cascade the resistive losses. The position of the decoupling capacitors is important to reduce losses. Place the decoupling capacitors as close to the devices as possible. See the PCB Layout for more details.