SBASB20 September   2024 DDS39RF10 , DDS39RFS10

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics - DC Specifications
    6. 6.6  Electrical Characteristics - AC Specifications
    7. 6.7  Electrical Characteristics - Power Consumption
    8. 6.8  Timing Requirements
    9. 6.9  Switching Characteristics
    10. 6.10 SPI and FRI Timing Diagrams
    11. 6.11 Typical Characteristics: Single Tone Spectra
    12. 6.12 Typical Characteristics: Dual Tone Spectra
    13. 6.13 Typical Characteristics: Power Dissipation and Supply Currents
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 DAC Output Modes
        1. 7.3.1.1 NRZ Mode
        2. 7.3.1.2 RTZ Mode
        3. 7.3.1.3 RF Mode
        4. 7.3.1.4 DES Mode
      2. 7.3.2 DAC Core
        1. 7.3.2.1 DAC Output Structure
        2. 7.3.2.2 Full-Scale Current Adjustment
      3. 7.3.3 DEM and Dither
      4. 7.3.4 Offset Adjustment
      5. 7.3.5 Clocking Subsystem
        1. 7.3.5.1 SYSREF Frequency Requirements
        2. 7.3.5.2 SYSREF Position Detector and Sampling Position Selection (SYSREF Windowing)
      6. 7.3.6 Digital Signal Processing Blocks
        1. 7.3.6.1 Digital Upconverter (DUC)
          1. 7.3.6.1.1 Interpolation Filters
          2. 7.3.6.1.2 Numerically Controlled Oscillator (NCO)
            1. 7.3.6.1.2.1 Phase-Continuous NCO Update Mode
            2. 7.3.6.1.2.2 Phase-coherent NCO Update Mode
            3. 7.3.6.1.2.3 Phase-sync NCO Update Mode
            4. 7.3.6.1.2.4 NCO Synchronization
              1. 7.3.6.1.2.4.1 JESD204C LSB Synchonization
            5. 7.3.6.1.2.5 NCO Mode Programming
          3. 7.3.6.1.3 Mixer Scaling
        2. 7.3.6.2 Channel Bonder
        3. 7.3.6.3 DES Interpolator
      7. 7.3.7 JESD204C Interface
        1. 7.3.7.1  Deviation from JESD204C Standard
        2. 7.3.7.2  Transport Layer
        3. 7.3.7.3  Scrambler and Descrambler
        4. 7.3.7.4  Link Layer
        5. 7.3.7.5  Physical Layer
        6. 7.3.7.6  Serdes PLL Control
        7. 7.3.7.7  Serdes Crossbar
        8. 7.3.7.8  Multi-Device Synchronization and Deterministic Latency
          1. 7.3.7.8.1 Programming RBD
        9. 7.3.7.9  Operation in Subclass 0 Systems
        10. 7.3.7.10 Link Reset
      8. 7.3.8 Alarm Generation
    4. 7.4 Device Functional Modes
      1. 7.4.1 DUC and DDS Modes
      2. 7.4.2 JESD204C Interface Modes
        1. 7.4.2.1 JESD204C Interface Modes
        2. 7.4.2.2 JESD204C Format Diagrams
          1. 7.4.2.2.1 16-bit Formats
      3. 7.4.3 NCO Synchronization Latency
      4. 7.4.4 Data Path Latency
    5. 7.5 Programming
      1. 7.5.1 Using the Standard SPI Interface
        1. 7.5.1.1 SCS
        2. 7.5.1.2 SCLK
        3. 7.5.1.3 SDI
        4. 7.5.1.4 SDO
        5. 7.5.1.5 Serial Interface Protocol
        6. 7.5.1.6 Streaming Mode
      2. 7.5.2 Using the Fast Reconfiguration Interface
      3. 7.5.3 SPI Register Map
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Startup Procedure for DUC/Bypass Mode
      2. 8.1.2 Startup Procedure for DDS Mode
      3. 8.1.3 Understanding Dual Edge Sampling Modes
      4. 8.1.4 Eye Scan Procedure
      5. 8.1.5 Pre/Post Cursor Analysis Procedure
      6. 8.1.6 Sleep and Disable Modes
    2. 8.2 Typical Application
      1. 8.2.1 S-Band Radar Transmitter
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
      4. 8.2.4 Detailed Clocking Subsystem Design Procedure
        1. 8.2.4.1 Example 1: SWAP-C Optimized
        2. 8.2.4.2 Example 2: Improved Phase Noise LMX2820 with External VCO
        3. 8.2.4.3 Example 3: Discrete Analog PLL for Best DAC Performance
        4. 8.2.4.4 10GHz Clock Generation
      5. 8.2.5 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Up and Down Sequence
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines and Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.7 JESD204C Interface

The devices uses a JESD204C high-speed serial interface to transfer data from the logic device to the receiving DAC. The device serial lanes are capable of operating with both 8b/10b encoding and 64b/66b encoding. The JESD204C formats using 8b/10b encoding are backwards compatible with existing JESD204B receivers. A maximum of 2 lanes can be used to lower lane rates for interfacing with speed limited logic devices. There are a few differences between 8b/10b and 64b/66b encoding, which is highlighted throughout this section. Figure 7-50 shows a simplified block diagram of the 8b/10b encoded JESD204C interface and Figure 7-51 shows a simplified block diagram of the 64b/66b encoded JESD204C interface.

DDS39RF10 DDS39RFS10 Simplified JESD204C Interface Diagram with 8b/10b EncodingFigure 7-50 Simplified JESD204C Interface Diagram with 8b/10b Encoding
DDS39RF10 DDS39RFS10 Simplified JESD204C Interface Diagram with 64b/66b EncodingFigure 7-51 Simplified JESD204C Interface Diagram with 64b/66b Encoding

Not all optional features of JESD204C are supported by the device. The list of features that are supported and the features that are not supported is provided in Table 7-15

Table 7-15 Declaration of Supported JESD204C Features
LETTER IDENTIFIERFEATURESUPPORTED BY DEVICE?
a8b/10b link layerYes
b64b/66b link layerYes
c64b/80b link layerNo
dThe command channel when using 64b/66b or 64b/80b link layerNo
eForward error correction (FEC) when using the 64b/66b or 64b/80b link layerNo
fCRC3 when using the 64b/66b or 64b/80b link layerNo
gA physical SYNC pin when using the 8b/10b link layerYes
hSubclass 0Yes
iSubclass 1Yes
jSubclass 2No
kLane alignment within a single linkYes
lSubclass 1 with support for lane alignment on a multipoint link by means of the MULTIREF signalNo
mSYNC interface timing compatible with JESD204AYes
nSYNC interface timing compatible with JESD204BYes

The various signals used in the JESD204C interface and the associated device pin names are summarized briefly in Table 7-16 for reference.

Table 7-16 Summary of JESD204C Signals
SIGNAL NAMEDEVICE PIN NAMESDESCRIPTION
Data6SRX±, 14SRX±High-speed serialized data after 8b/10b or 64b/66b encoding that is received by the SerDes receivers.
SYNCSYNCLink initialization signal (handshake), toggles low to start code group synchronization (CGS) process. Not used for 64B/66B encoding modes.
Device clockCLK+, CLK–DAC sampling clock, also used for clocking digital logic and SerDes receivers.
SYSREFSYSREF+, SYSREF–System timing reference used to deterministically reset the internal local multiframe clock (LMFC) or local extended multiblock clock (LEMC) counters in each JESD204C device