SBASB20 September   2024 DDS39RF10 , DDS39RFS10

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics - DC Specifications
    6. 6.6  Electrical Characteristics - AC Specifications
    7. 6.7  Electrical Characteristics - Power Consumption
    8. 6.8  Timing Requirements
    9. 6.9  Switching Characteristics
    10. 6.10 SPI and FRI Timing Diagrams
    11. 6.11 Typical Characteristics: Single Tone Spectra
    12. 6.12 Typical Characteristics: Dual Tone Spectra
    13. 6.13 Typical Characteristics: Power Dissipation and Supply Currents
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 DAC Output Modes
        1. 7.3.1.1 NRZ Mode
        2. 7.3.1.2 RTZ Mode
        3. 7.3.1.3 RF Mode
        4. 7.3.1.4 DES Mode
      2. 7.3.2 DAC Core
        1. 7.3.2.1 DAC Output Structure
        2. 7.3.2.2 Full-Scale Current Adjustment
      3. 7.3.3 DEM and Dither
      4. 7.3.4 Offset Adjustment
      5. 7.3.5 Clocking Subsystem
        1. 7.3.5.1 SYSREF Frequency Requirements
        2. 7.3.5.2 SYSREF Position Detector and Sampling Position Selection (SYSREF Windowing)
      6. 7.3.6 Digital Signal Processing Blocks
        1. 7.3.6.1 Digital Upconverter (DUC)
          1. 7.3.6.1.1 Interpolation Filters
          2. 7.3.6.1.2 Numerically Controlled Oscillator (NCO)
            1. 7.3.6.1.2.1 Phase-Continuous NCO Update Mode
            2. 7.3.6.1.2.2 Phase-coherent NCO Update Mode
            3. 7.3.6.1.2.3 Phase-sync NCO Update Mode
            4. 7.3.6.1.2.4 NCO Synchronization
              1. 7.3.6.1.2.4.1 JESD204C LSB Synchonization
            5. 7.3.6.1.2.5 NCO Mode Programming
          3. 7.3.6.1.3 Mixer Scaling
        2. 7.3.6.2 Channel Bonder
        3. 7.3.6.3 DES Interpolator
      7. 7.3.7 JESD204C Interface
        1. 7.3.7.1  Deviation from JESD204C Standard
        2. 7.3.7.2  Transport Layer
        3. 7.3.7.3  Scrambler and Descrambler
        4. 7.3.7.4  Link Layer
        5. 7.3.7.5  Physical Layer
        6. 7.3.7.6  Serdes PLL Control
        7. 7.3.7.7  Serdes Crossbar
        8. 7.3.7.8  Multi-Device Synchronization and Deterministic Latency
          1. 7.3.7.8.1 Programming RBD
        9. 7.3.7.9  Operation in Subclass 0 Systems
        10. 7.3.7.10 Link Reset
      8. 7.3.8 Alarm Generation
    4. 7.4 Device Functional Modes
      1. 7.4.1 DUC and DDS Modes
      2. 7.4.2 JESD204C Interface Modes
        1. 7.4.2.1 JESD204C Interface Modes
        2. 7.4.2.2 JESD204C Format Diagrams
          1. 7.4.2.2.1 16-bit Formats
      3. 7.4.3 NCO Synchronization Latency
      4. 7.4.4 Data Path Latency
    5. 7.5 Programming
      1. 7.5.1 Using the Standard SPI Interface
        1. 7.5.1.1 SCS
        2. 7.5.1.2 SCLK
        3. 7.5.1.3 SDI
        4. 7.5.1.4 SDO
        5. 7.5.1.5 Serial Interface Protocol
        6. 7.5.1.6 Streaming Mode
      2. 7.5.2 Using the Fast Reconfiguration Interface
      3. 7.5.3 SPI Register Map
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Startup Procedure for DUC/Bypass Mode
      2. 8.1.2 Startup Procedure for DDS Mode
      3. 8.1.3 Understanding Dual Edge Sampling Modes
      4. 8.1.4 Eye Scan Procedure
      5. 8.1.5 Pre/Post Cursor Analysis Procedure
      6. 8.1.6 Sleep and Disable Modes
    2. 8.2 Typical Application
      1. 8.2.1 S-Band Radar Transmitter
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
      4. 8.2.4 Detailed Clocking Subsystem Design Procedure
        1. 8.2.4.1 Example 1: SWAP-C Optimized
        2. 8.2.4.2 Example 2: Improved Phase Noise LMX2820 with External VCO
        3. 8.2.4.3 Example 3: Discrete Analog PLL for Best DAC Performance
        4. 8.2.4.4 10GHz Clock Generation
      5. 8.2.5 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Up and Down Sequence
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines and Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
PARAMETER TEST CONDITIONS MIN MAX UNIT
Supply voltage range Supply voltage range, VDDA18A, VDDA18B(2) -0.3 2.45 V
Supply voltage range, VEEAM18, VEEBM18(2) -2.0 0.3 V
Supply voltage range, VDDCLK18, VDDSYS18(3) -0.3 2.45 V
Supply voltage range, VDDLB, VDDLA, VDDCLK10(3) -0.3 1.3 V
Supply voltage range, VDDIO, VQPS, VDDR18(4) -0.3 2.45 V
Supply voltage range, VDDDIG, VDDEB, VDDEA, VDDT(4) -0.3 1.3 V
Voltage between any combination of AGND, DGND and VSSCLK Voltage between any combination of AGND, DGND and VSSCLK -0.1 0.1 V
Voltage applied to input pins CLK+, CLK–, SYSREF+, SYSREF-(3) -0.3 VDDCLK18+0.3 V
6SRX-/+, 14SRX-/+ AC Voltage 1.6
6SRX-/+, 14SRX-/+ DC Voltage to GND -5 5
SCLK, SCS, SDI, RESET, SYNC, SCANEN, TXEN[0:1], FRDI[0:3], FRCLK, FRCS, SYNC(4) -0.3 VDDIO+0.3
EXTREF(2) -0.3 VDDA18A + 0.3
Voltage at output pins DACOUTA+, DACOUTA-(2) -0.3 VDDA18A + 0.5 V
DACOUTB+, DACOUTB-(2) -0.3 VDDA18B + 0.5
ATEST, RBIAS-/+(2) -0.5 VDDA18B + 0.3
SDI, SDO, ALARM(4) -0.5 VDDIO + 0.3
Peak input current (any input) -20 20 mA
Peak total input current (sum of absolute value of all currents forced in or out, not including power supply current and DACOUTA+, DACOUTA–, DACOUTB+ and DACOUTB–) 30 mA
Junction temperature, TJ 150 °C
Storage temperature, Tstg -65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Measured to AGND.
(3) Measured to VSSCLK.
(4) Measured to DGND.