SBASB20 September   2024 DDS39RF10 , DDS39RFS10

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics - DC Specifications
    6. 6.6  Electrical Characteristics - AC Specifications
    7. 6.7  Electrical Characteristics - Power Consumption
    8. 6.8  Timing Requirements
    9. 6.9  Switching Characteristics
    10. 6.10 SPI and FRI Timing Diagrams
    11. 6.11 Typical Characteristics: Single Tone Spectra
    12. 6.12 Typical Characteristics: Dual Tone Spectra
    13. 6.13 Typical Characteristics: Power Dissipation and Supply Currents
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 DAC Output Modes
        1. 7.3.1.1 NRZ Mode
        2. 7.3.1.2 RTZ Mode
        3. 7.3.1.3 RF Mode
        4. 7.3.1.4 DES Mode
      2. 7.3.2 DAC Core
        1. 7.3.2.1 DAC Output Structure
        2. 7.3.2.2 Full-Scale Current Adjustment
      3. 7.3.3 DEM and Dither
      4. 7.3.4 Offset Adjustment
      5. 7.3.5 Clocking Subsystem
        1. 7.3.5.1 SYSREF Frequency Requirements
        2. 7.3.5.2 SYSREF Position Detector and Sampling Position Selection (SYSREF Windowing)
      6. 7.3.6 Digital Signal Processing Blocks
        1. 7.3.6.1 Digital Upconverter (DUC)
          1. 7.3.6.1.1 Interpolation Filters
          2. 7.3.6.1.2 Numerically Controlled Oscillator (NCO)
            1. 7.3.6.1.2.1 Phase-Continuous NCO Update Mode
            2. 7.3.6.1.2.2 Phase-coherent NCO Update Mode
            3. 7.3.6.1.2.3 Phase-sync NCO Update Mode
            4. 7.3.6.1.2.4 NCO Synchronization
              1. 7.3.6.1.2.4.1 JESD204C LSB Synchonization
            5. 7.3.6.1.2.5 NCO Mode Programming
          3. 7.3.6.1.3 Mixer Scaling
        2. 7.3.6.2 Channel Bonder
        3. 7.3.6.3 DES Interpolator
      7. 7.3.7 JESD204C Interface
        1. 7.3.7.1  Deviation from JESD204C Standard
        2. 7.3.7.2  Transport Layer
        3. 7.3.7.3  Scrambler and Descrambler
        4. 7.3.7.4  Link Layer
        5. 7.3.7.5  Physical Layer
        6. 7.3.7.6  Serdes PLL Control
        7. 7.3.7.7  Serdes Crossbar
        8. 7.3.7.8  Multi-Device Synchronization and Deterministic Latency
          1. 7.3.7.8.1 Programming RBD
        9. 7.3.7.9  Operation in Subclass 0 Systems
        10. 7.3.7.10 Link Reset
      8. 7.3.8 Alarm Generation
    4. 7.4 Device Functional Modes
      1. 7.4.1 DUC and DDS Modes
      2. 7.4.2 JESD204C Interface Modes
        1. 7.4.2.1 JESD204C Interface Modes
        2. 7.4.2.2 JESD204C Format Diagrams
          1. 7.4.2.2.1 16-bit Formats
      3. 7.4.3 NCO Synchronization Latency
      4. 7.4.4 Data Path Latency
    5. 7.5 Programming
      1. 7.5.1 Using the Standard SPI Interface
        1. 7.5.1.1 SCS
        2. 7.5.1.2 SCLK
        3. 7.5.1.3 SDI
        4. 7.5.1.4 SDO
        5. 7.5.1.5 Serial Interface Protocol
        6. 7.5.1.6 Streaming Mode
      2. 7.5.2 Using the Fast Reconfiguration Interface
      3. 7.5.3 SPI Register Map
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Startup Procedure for DUC/Bypass Mode
      2. 8.1.2 Startup Procedure for DDS Mode
      3. 8.1.3 Understanding Dual Edge Sampling Modes
      4. 8.1.4 Eye Scan Procedure
      5. 8.1.5 Pre/Post Cursor Analysis Procedure
      6. 8.1.6 Sleep and Disable Modes
    2. 8.2 Typical Application
      1. 8.2.1 S-Band Radar Transmitter
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
      4. 8.2.4 Detailed Clocking Subsystem Design Procedure
        1. 8.2.4.1 Example 1: SWAP-C Optimized
        2. 8.2.4.2 Example 2: Improved Phase Noise LMX2820 with External VCO
        3. 8.2.4.3 Example 3: Discrete Analog PLL for Best DAC Performance
        4. 8.2.4.4 10GHz Clock Generation
      5. 8.2.5 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Up and Down Sequence
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines and Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.6.1 Digital Upconverter (DUC)

Each DUC interpolates the I and Q signals by factors ranging from LT = 2, 3, 4, 6, 8, 12, 16, 24, 32, 48, 64, 96, 128, 192 and 256. The resulting up-converted baseband I/Q signal is then multiplied by a complex sinusoid generated by the numerically controlled oscillator (NCO) to mix the signal to the desired carrier frequency for output from the DAC. The interpolation factors supported vs the number of DUCs enabled is listed in Table 7-7.

Table 7-7 Supported Interpolation Factors vs Number of DUCs Enabled
Number of Streams (JESD_M)Interpolation Factors Supported (LT)DUCs Enabled
22-256xDUC0
44-256xDUC0, DUC1
68-256xDUC0, DUC1, DUC2
88-256xDUC0, DUC1, DUC2, DUC3

The NCOs and mixer can be bypassed, essentially setting the frequency and phase to 0, in which case the I input passes to the I output and the Q input passes to the Q output.