DLPS226C november   2021  – july 2023 DLP160AP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  Switching Characteristics
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Micromirror Array Physical Characteristics
    11. 6.11 Micromirror Array Optical Characteristics
    12. 6.12 Window Characteristics
    13. 6.13 Chipset Component Usage Specification
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Interface
      2. 7.3.2 Low-Speed Interface
      3. 7.3.3 High-Speed Interface
      4. 7.3.4 Timing
    4. 7.4 Device Functional Modes
    5. 7.5 Optical Interface and System Image Quality Considerations
      1. 7.5.1 Numerical Aperture and Stray Light Control
      2. 7.5.2 Pupil Match
      3. 7.5.3 Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Power Density Calculation
    8. 7.8 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.8.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.8.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.8.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.8.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  10. 9 Power Supply Recommendations
    1. 9.1 Power Supply Power-Up Procedure
    2. 9.2 Power Supply Power-Down Procedure
    3. 9.3 Power Supply Sequencing Requirements
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Device Nomenclature
      3. 11.1.3 Device Markings
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.3 Power Supply Sequencing Requirements

GUID-625DD6D4-421B-4C27-AD51-41A75E315037-low.gif
A. Refer to Table 9-1 and Figure 9-2 for critical power-up sequence delay requirements.
B. To prevent excess current, the supply voltage delta |VBIAS – VOFFSET| must be less than specified in Section 6.4. OEMs may find that the most reliable way to ensure this is to power VOFFSET prior to VBIAS during power-up and to remove VBIAS prior to VOFFSET during power-down. Refer to Table 9-1 and Figure 9-2 for power-up delay requirements.
C. To prevent excess current, the supply voltage delta |VBIAS – VRESET| must be less than the specified limit shown in Section 6.4.
D. When system power is interrupted, the DLPA2000/2005 initiates hardware power-down that disables VBIAS, VRESET and VOFFSET after the micromirror park sequence.
E. Drawing is not to scale and details are omitted for clarity.
Figure 9-1 Power Supply Sequencing Requirements (Power Up and Power Down)
Table 9-1 Power-Up Sequence Delay Requirement
PARAMETERMINMAXUNIT
tDELAYDelay requirement from VOFFSET power up to VBIAS power up2ms
VOFFSETSupply voltage level at beginning of power–up sequence delay (see Figure 9-2)6V
VBIASSupply voltage level at end of power–up sequence delay (see Figure 9-2)6V
GUID-5C172967-70CA-4785-8CD5-6D0F00E3486A-low.gif
Refer to Table 9-1 for VOFFSET and VBIAS supply voltage levels during power-up sequence delay.
Figure 9-2 Power-Up Sequence Delay Requirement