DLPS140B March   2019  – May 2022 DLP2000

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  System Mounting Interface Loads
    9. 6.9  Physical Characteristics of the Micromirror Array
    10. 6.10 Micromirror Array Optical Characteristics
    11. 6.11 Window Characteristics
    12. 6.12 Chipset Component Usage Specification
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Interface
      2. 7.3.2 Control Serial Interface
      3. 7.3.3 High Speed Interface
      4. 7.3.4 Timing
    4. 7.4 Device Functional Modes
    5. 7.5 Window Characteristics and Optics
      1. 7.5.1 Optical Interface and System Image Quality
        1. 7.5.1.1 Numerical Aperture and Stray Light Control
        2. 7.5.1.2 Pupil Match
        3. 7.5.1.3 Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Power-Up Procedure
    2. 9.2 Power Supply Power-Down Procedure
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Third-Party Products Disclaimer
    2. 11.2 Device Support
      1. 11.2.1 Device Nomenclature
      2. 11.2.2 Device Markings
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply Voltage VCC LVCMOS logic supply voltage(2) –0.5 4 V
VOFFSET Mirror electrode and HVCMOS voltage(2) –0.5 8.75 V
VBIAS Mirror electrode voltage –0.5 17 V
|VBIAS – VOFFSET| Supply voltage delta(3) 8.75 V
VRESET Mirror electrode voltage –11 0.5 V
Input Voltage Input voltage: other inputs See (2). –0.5 VCC + 0.3 V
Clock Frequency DCLK Clock frequency 60 80 MHz
Environmental TARRAY and TWINDOW Temperature—operational(4) –20 90 °C
Temperature—non-operational(4) –40 90 °C
TDP Dew point temperature—operating and non-operating (non-condensing) See note(5). °C
|TDELTA| Absolute temperature delta between any point on the window edge and the ceramic test point TP1(6) 30 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) All voltage values are with respect to GND (VSS). VOFFSET, VCC, VBIAS, VRESET and VSS power supplies are required for the normal DMD operating mode.
(3) To prevent excess current, the supply voltage delta |VBIAS – VOFFSET| must be less than 8.75 V.
(4) The highest temperature of the active array (as calculated in Section 7.6) or of any point along the Window Edge as defined in Figure 7-1.
(5) The DLP2000 DMD is intended for use in well controlled, low dew point environments.  Please contact your local TI sales person or TI distributor representative to determine if this device is suitable for your application and operating environment compared to other DMD solutions. DLP® Products offers a broad portfolio of DMDs suitable for a wide variety of applications.
(6) Temperature delta is the highest difference between the ceramic test point 1 (TP1) and anywhere on the window edge as shown in Figure 7-1.