Over operating free-air temperature range (unless otherwise noted)(1)(2)
|
MIN |
NOM |
MAX |
UNIT |
SUPPLY
VOLTAGE RANGE(3) |
VDD |
Supply voltage for LVCMOS core logic Supply voltage for LPSDR low-speed
interface |
1.65 |
1.8 |
1.95 |
V |
VDDI |
Supply voltage for SubLVDS receivers |
1.65 |
1.8 |
1.95 |
V |
VOFFSET |
Supply voltage for HVCMOS and micromirror
electrode(4) |
9.5 |
10 |
10.5 |
V |
VBIAS |
Supply voltage for mirror electrode |
17.5 |
18 |
18.5 |
V |
VRESET |
Supply voltage for micromirror electrode |
–14.5 |
–14 |
–13.5 |
V |
|VDDI–VDD| |
Supply voltage delta (absolute value)(5) |
|
|
0.3 |
V |
|VBIAS–VOFFSET| |
Supply voltage delta (absolute value)(6) |
|
|
10.5 |
V |
|VBIAS–VRESET| |
Supply voltage delta (absolute value)(7) |
|
|
33 |
V |
CLOCK
FREQUENCY |
ƒclock |
Clock frequency for low speed interface LS_CLK(8) |
108 |
|
120 |
MHz |
ƒclock |
Clock frequency for high speed interface DCLK(9) |
300 |
|
540 |
MHz |
|
Duty cycle distortion DCLK |
44% |
|
56% |
|
SUBLVDS
INTERFACE(9) |
| VID | |
SubLVDS input differential voltage (absolute value)
Figure 6-9, Figure 6-10 |
150 |
250 |
350 |
mV |
VCM |
Common mode voltage Figure 6-9, Figure 6-10 |
700 |
900 |
1100 |
mV |
VSUBLVDS |
SubLVDS voltage Figure 6-9, Figure 6-10 |
575 |
|
1225 |
mV |
ZLINE |
Line differential impedance (PWB/trace) |
90 |
100 |
110 |
Ω |
ZIN |
Internal differential termination resistance Figure 6-11 |
80 |
100 |
120 |
Ω |
|
100-Ω differential PCB trace |
6.35 |
|
152.4 |
mm |
ENVIRONMENTAL |
TARRAY |
Array Temperature – long-term operational(10)(11)(12) |
0 |
|
40 |
°C |
Array Temperature - short-term operational, 25 hr
max(11)(13) |
–20 |
|
–10 |
Array Temperature - short-term operational, 500 hr
max(11)(13) |
–10 |
|
0 |
|TDELTA | |
Absolute Temperature difference
between any point on the window edge and the ceramic test point TP1
(14) |
|
|
15 |
°C |
TWINDOW |
Window temperature – operational(15) |
|
|
85 |
°C |
TDP-AVG |
Average dew point temperature (non-condensing)(16) |
|
|
24 |
°C |
TDP-ELR |
Elevated dew point temperature range
(non-condensing)(17) |
28 |
|
36 |
°C |
CTELR |
Cumulative time in elevated dew
point temperature range |
|
|
6 |
Months |
QAP-ILL
|
Illumination overfill in critical
area(19)(20)
|
|
|
0 |
W/cm2
|
ILLUV |
Illumination wavelengths < 380
nm(10) |
|
|
2 |
mW/cm2 |
ILL380 - 390 nm |
Illumination wavelengths between 380
nm and 390 nm |
|
|
55 |
mW/cm2 |
ILL390 - 400 nm |
Illumination wavelengths between 390
nm and 400 nm |
|
|
450 |
mW/cm2 |
ILL400 - 550 nm |
Illumination wavelengths between 400
nm and 550 nm |
|
|
3 |
W/cm2 |
ILL> 550 nm |
Illumination wavelengths > 550
nm |
|
|
10 |
mW/cm2 |
ILLθ |
Illumination marginal ray angle(18) |
|
|
55 |
deg |
(1) Section 6.4 is applicable after the
DMD is installed in the final product.
(2) The functional performance of the device specified in this
datasheet is achieved when operating the device within the limits defined by
Section 6.4. No
level of performance is implied when operating the device above or below the
Section 6.4 limits.
(3) All voltage values are with respect to the ground pins
(VSS).
(4) VOFFSET supply transients must fall within specified maximum
voltages.
(5) To prevent excess current, the supply voltage delta |VDDI – VDD|
must be less than specified limit.
(6) To prevent excess current, the supply voltage delta |VBIAS –
VOFFSET| must be less than specified limit.
(7) To prevent excess current, the supply voltage delta |VBIAS –
VRESET| must be less than specified limit.
(8) LS_CLK must run as specified to ensure internal DMD timing for
reset waveform commands.
(9) Refer to the SubLVDS timing requirements in
Section 6.7.
(10) Simultaneous exposure of the DMD to the maximum limits in
Section 6.4 for
temperature and UV illumination will reduce device lifetime.
(11) The array temperature cannot be measured directly and must be
computed analytically from the temperature measured at test point 1 (TP1) shown
in
Section 7.6 and the Package Thermal Resistance using
Section 7.6.
(12) Long-term is defined as the usable life of the device.
(13) Short-term is the total cumulative time over the useful life of
the device.
(14) Temperature delta is the highest difference between the ceramic
test point 1 (TP1) and anywhere on the window edge shown in
Section 7.6. The window test points TP2 and TP3 shown in
Section 7.6 are intended to result in the worst case delta temperature.
If a particular application causes another point on the window edge to result in
a larger delta temperature, that point should be used.
(15) Window temperature is the highest temperature on the window
edge shown in
Section 7.6. The locations of thermal test points TP2 and TP3 in
Section 7.6 are intended to measure the highest window edge temperature.
If a particular application causes another point on the window edge to result in
a higher temperature, that point should be used.
(16) The average over time (including storage and operating) that the
device is not in the elevated dew point temperature range.
(17) Exposure to dew point temperatures in the elevated range during
storage and operation should be limited to less than a total cumulative time of
CTELR.
(18) The maximum marginal ray angle of the incoming illumination
light at any point in the micromirror array, including Pond of Micromirrors
(POM), should not exceed 55 degrees from the normal to the device array plane.
The device window aperture has not necessarily been designed to allow incoming
light at higher maximum angles to pass to the micromirrors, and the device
performance has not been tested nor qualified at angles exceeding this.
Illumination light exceeding this angle outside the micromirror array (including
POM) will contribute to thermal limitations described in this document, and may
negatively affect lifetime.
(19) The active area of the device is surrounded by an aperture on
the inside of the DMD window surface that masks structures of the DMD device
assembly from normal view. The window aperture is sized to anticipate several
optical operating conditions. Overfill light directly illuminating the window
aperture can create adverse imaging effects, and additional device heating
leading to reduced device lifetime. Direct incident illumination should be
prevented from striking the DMD window aperture.
(20) Applies to the region in red in
Figure 6-1, at the inside plane of the glass window where the physical aperture is
located.