DLPS081 February   2022 DLP3020-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  Switching Characteristics
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Physical Characteristics of the Micromirror Array
    11. 6.11 Micromirror Array Optical Characteristics
    12. 6.12 Window Characteristics
    13. 6.13 Chipset Component Usage Specification
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Micromirror Array
      2. 7.3.2 Double Data Rate (DDR) Interface
      3. 7.3.3 Micromirror Switching Control
      4. 7.3.4 DMD Voltage Supplies
      5. 7.3.5 Logic Reset
      6. 7.3.6 Temperature Sensing Diode
        1. 7.3.6.1 Temperature Sense Diode Theory
      7. 7.3.7 DMD JTAG Interface
    4. 7.4 System Optical Considerations
      1. 7.4.1 Numerical Aperture and Stray Light Control
      2. 7.4.2 Pupil Match
      3. 7.4.3 Illumination Overfill and Alignment
    5. 7.5 DMD Image Performance Specification
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Landed-On/Landed-Off Duty Cycle
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
    3. 8.3 Application Mission Profile Consideration
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Sequencing Requirements
      1. 9.1.1 Power Up and Power Down
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Temperature Diode Pins
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
      2. 11.1.2 Device Markings
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Device Handling
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.7 DMD JTAG Interface

The DMD uses 4 standard JTAG signals for sending and receiving boundary scan test data. TCK is the test clock used to drive an IEEE 1149.1 TAP state machine and logic. TMS directs the next state of the TAP state machine. TDI is the scan data input and TDO is the scan data output.

The DMD does not support IEEE 1149.1 signals TRST (Test Logic Reset) and RTCK (Returned Test Clock). Boundary scan cells on the DMD are Observe-Only. To initiate the JTAG boundary scan operation on the DMD, a minimum of 6 TCK clock cycles are required after TMS is set to logic high.

Refer to Figure 7-4 for a JTAG system board routing example.

GUID-36FB9D2B-F4B9-4D3A-BC9B-375C268CDC3D-low.gifFigure 7-4 System Interface Connection to DLP Products Controller

The DMD Device ID can be read via the JTAG interface. The ID and 32-bit shift order is shown in Figure 7-5.

GUID-D9C402AC-91DC-4FF3-9B54-03F75B351449-low.gifFigure 7-5 DMD Device ID and 32-bit Shift Order

Refer to Figure 7-6 for a JTAG boundary scan block diagram for the DMD. These show the pins and the scan order that are observed during the JTAG boundary scan.

GUID-22A7012E-82DE-4F35-872B-DE52ED1ABDB8-low.gifFigure 7-6 JTAG Boundary Scan Path

Refer to Figure 7-7 for a functional block diagram of the JTAG control logic.

GUID-0E98DB2A-86B5-4BB2-A54A-671445F723D3-low.gifFigure 7-7 JTAG Functional Block Diagram