DLPS151B January   2019  – May 2022 DLP4500

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Chipset Component Usage Specification
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Storage Conditions
    3. 7.3  ESD Ratings
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Thermal Information
    6. 7.6  Electrical Characteristics
    7. 7.7  Timing Requirements
    8. 7.8  System Mounting Interface Loads
    9. 7.9  Micromirror Array Physical Characteristics
    10. 7.10 Micromirror Array Optical Characteristics
    11. 7.11 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operating Modes
    5. 8.5 Micromirror Array Temperature Calculation
      1. 8.5.1 Package Thermal Resistance
      2. 8.5.2 Case Temperature
        1. 8.5.2.1 Temperature Calculation
    6. 8.6 Micromirror Landed-on/Landed-Off Duty Cycle
      1. 8.6.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 8.6.2 Landed Duty Cycle and Useful Life of the DMD
      3. 8.6.3 Landed Duty Cycle and Operational DMD Temperature
      4. 8.6.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 DLPC350 System Interfaces
          1. 9.2.2.1.1 Control Interface
          2. 9.2.2.1.2 Input Data Interface
        2. 9.2.2.2 DLPC350 System Output Interfaces
          1. 9.2.2.2.1 Illumination Interface
          2. 9.2.2.2.2 Trigger Interface (Sync Outputs)
        3. 9.2.2.3 DLPC350 System Support Interfaces
          1. 9.2.2.3.1 Reference Clock
          2. 9.2.2.3.2 PLL
          3. 9.2.2.3.3 Program Memory Flash Interface
        4. 9.2.2.4 DMD Interfaces
          1. 9.2.2.4.1 DLPC350 to DMD Digital Data
          2. 9.2.2.4.2 DLPC350 to DMD Control Interface
          3. 9.2.2.4.3 DLPC350 to DMD Micromirror Reset Control Interface
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Sequencing Requirements
    2. 10.2 DMD Power Supply Power-Up Procedure
    3. 10.3 DMD Power Supply Power-Down Procedure
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 DMD Interface Design Considerations
      2. 11.1.2 DMD Termination Requirements
      3. 11.1.3 Decoupling Capacitors
      4. 11.1.4 Power Plane Recommendations
      5. 11.1.5 Signal Layer Recommendations
      6. 11.1.6 General Handling Guidelines for CMOS-Type Pins
      7. 11.1.7 PCB Manufacturing
        1. 11.1.7.1 General Guidelines
        2. 11.1.7.2 Trace Widths and Minimum Spacings
        3. 11.1.7.3 Routing Constraints
        4. 11.1.7.4 Fiducials
        5. 11.1.7.5 Flex Considerations
        6. 11.1.7.6 DLPC350 Thermal Considerations
    2. 11.2 Layout Example
      1. 11.2.1 Printed Circuit Board Layer Stackup Geometry
      2. 11.2.2 Recommended DLPC350 MOSC Crystal Oscillator Configuration
      3. 11.2.3 Recommended DLPC350 PLL Layout Configuration
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Device Nomenclature
    2. 12.2 Device Markings
    3. 12.3 Documentation Support
      1. 12.3.1 Related Documentation
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Support Resources
    6.     Trademarks
    7. 12.6 Electrostatic Discharge Caution
    8. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.6.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle

The micromirror landed-on/landed-off duty cycle (landed duty cycle) denotes the amount of time (as a percentage) that an individual micromirror is landed in the On–state versus the amount of time the same micromirror is landed in the Off–state.

As an example, a landed duty cycle of 75/25 indicates that the referenced micromirror is in the On–state 75% of the time (and in the Off–state 25% of the time); whereas 25/75 would indicate that the micromirror is in the On–state 25% of the time. Likewise, 50/50 indicates that the micromirror is On 50% of the time and Off 50% of the time.

Note that when assessing landed duty cycle, the time spent switching from one state (ON or OFF) to the other state (OFF or ON) is considered negligible and is thus ignored.

Since a micromirror can only be landed in one state or the other (ON or OFF), the two numbers (percentages) always add to 100.