DLPS147B January   2019  – May 2022 DLP4500NIR

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Chipset Component Usage Specification
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Storage Conditions
    3. 7.3  ESD Ratings
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Thermal Information
    6. 7.6  Electrical Characteristics
    7. 7.7  Timing Requirements
    8. 7.8  System Mounting Interface Loads
    9. 7.9  Micromirror Array Physical Characteristics
    10. 7.10 Micromirror Array Optical Characteristics
    11. 7.11 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operating Modes
    5. 8.5 Micromirror Array Temperature Calculation
      1. 8.5.1 Package Thermal Resistance
      2. 8.5.2 Case Temperature
        1. 8.5.2.1 Temperature Calculation
    6. 8.6 Micromirror Landed-on/Landed-Off Duty Cycle
      1. 8.6.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 8.6.2 Landed Duty Cycle and Useful Life of the DMD
      3. 8.6.3 Landed Duty Cycle and Operational DMD Temperature
      4. 8.6.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 DLPC350 System Interfaces
          1. 9.2.2.1.1 Control Interface
          2. 9.2.2.1.2 Input Data Interface
        2. 9.2.2.2 DLPC350 System Output Interfaces
          1. 9.2.2.2.1 Illumination Interface
          2. 9.2.2.2.2 Trigger Interface (Sync Outputs)
        3. 9.2.2.3 DLPC350 System Support Interfaces
          1. 9.2.2.3.1 Reference Clock
          2. 9.2.2.3.2 PLL
          3. 9.2.2.3.3 Program Memory Flash Interface
        4. 9.2.2.4 DMD Interfaces
          1. 9.2.2.4.1 DLPC350 to DMD Digital Data
          2. 9.2.2.4.2 DLPC350 to DMD Control Interface
          3. 9.2.2.4.3 DLPC350 to DMD Micromirror Reset Control Interface
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Sequencing Requirements
    2. 10.2 DMD Power Supply Power-Up Procedure
    3. 10.3 DMD Power Supply Power-Down Procedure
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 DMD Interface Design Considerations
      2. 11.1.2 DMD Termination Requirements
      3. 11.1.3 Decoupling Capacitors
      4. 11.1.4 Power Plane Recommendations
      5. 11.1.5 Signal Layer Recommendations
      6. 11.1.6 General Handling Guidelines for CMOS-Type Pins
      7. 11.1.7 PCB Manufacturing
        1. 11.1.7.1 General Guidelines
        2. 11.1.7.2 Trace Widths and Minimum Spacings
        3. 11.1.7.3 Routing Constraints
        4. 11.1.7.4 Fiducials
        5. 11.1.7.5 Flex Considerations
        6. 11.1.7.6 DLPC350 Thermal Considerations
    2. 11.2 Layout Example
      1. 11.2.1 Printed Circuit Board Layer Stackup Geometry
      2. 11.2.2 Recommended DLPC350 MOSC Crystal Oscillator Configuration
      3. 11.2.3 Recommended DLPC350 PLL Layout Configuration
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Device Nomenclature
      3. 12.1.3 Device Markings
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.10 Micromirror Array Optical Characteristics

TI assumes no responsibility for end-equipment optical performance. Achieving the desired end-equipment optical performance involves making trade-offs between numerous component and system design parameters. See the related application reports in Section 12.2.1 for guidelines.
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
α Micromirror tilt angle DMD parked state (1) (3) (4), see (10) 0 degrees
DMD landed state (1) (5) (6), see (10) 11 12 13
β Micromirror tilt angle variation (1) (5) (7) (8) (9) See (10) –1 1 degrees
Micromirror crossover time (2) (11) 5 μs
Micromirror switching time (11) 16 μs
Orientation of the micromirror axis-of-rotation (12) 89 90 91 degrees
Micromirror array fill factor (13) (14) (17) f/3 illumination at 24 degree angle, mirrors tilted toward illumination 92%
Mirror metal specular reflectivity (13) (14) 700 nm to 2500 nm 89%
Window material Corning Eagle XG
Window aperture See (15)
Illumination overfill (16) See (16)
Window transmittance (single pass through two window surfaces) (13) (14) 2000 nm to 2500 nm, See Figure 7-5 90%
Image performance(18) Bright pixel(s) in active area (19) Gray 10 Screen (20) 0 micromirrors
Bright pixel(s) in the POM (21) Gray 10 Screen (20) 1
Dark pixel(s) in the active area (22) White Screen 4
Adjacent pixel(s) (23) Any Screen 0
Unstable pixel(s) in active area (24) Any Screen 0
(1) Measured relative to the plane formed by the overall micromirror array.
(2) Micromirror crossover time is primarily a function of the natural response time of the micromirrors.
(3) Parking the micromirror array returns all of the micromirrors to a relatively flat (0°) state (as measured relative to the plane formed by the overall micromirror array).
(4) When the micromirror array is parked, the tilt angle of each individual micromirror is uncontrolled.
(5) Additional variation exists between the micromirror array and the package datums.
(6) When the micromirror array is landed, the tilt angle of each individual micromirror is dictated by the binary contents of the CMOS memory cell associated with each individual micromirror. A binary value of 1 results in a micromirror landing in an nominal angular position of +12°. A binary value of 0 results in a micromirror landing in an nominal angular position of –12°.
(7) Represents the landed tilt angle variation relative to the nominal landed tilt angle
(8) Represents the variation that can occur between any two individual micromirrors, located on the same device or located on different devices.
(9) For some applications, it is critical to account for the micromirror tilt angle variation in the overall system optical design. With some system optical designs, the micromirror tilt angle variation within a device may result in perceivable non-uniformities in the light field reflected from the micromirror array. With some system optical designs, the micromirror tilt angle variation between devices may result in colorimetry variations or system contrast variations.
(10) See Figure 8-2.
(11) Performance as measured at the start of life.
(12) Measured relative to the package datums B and C, shown in the Package Mechanical Data section in Section 13.
(13) The nominal DMD total optical efficiency results from the following four components:
  • Micromirror array fill factor
  • Micromirror array diffraction efficiency
  • Micromirror surface reflectivity (very similar to the reflectivity of bulk Aluminum)
  • Window Transmission (single pass through two surfaces for incoming light, and single pass through two surfaces for reflected light)
(14) The DMD diffraction efficiency and total optical efficiency observed in a specific application depends on numerous application-specific design variables, such as:
  • Illumination wavelength, bandwidth or line-width, degree of coherence
  • Illumination angle, plus angle tolerence
  • Illumination and projection aperture size, and location in the system optical path
  • Illumination overfill of the DMD micromirror array
  • Aberrations present in the illumination source or path, or both
  • Aberrations present in the projection path

Does not account for the effect of micromirror switching duty cycle, which is application dependent. Micromirror switching duty cycle represents the percentage of time that the micromirror is actually reflecting light from the optical illumination path to the optical projection path. This duty cycle depends on the illumination aperture size, the projection aperture size, and the micromirror array update rate.
(15) See the Package Mechanical Characteristics in Section 13 for details regarding the size and location of the window aperture.
(16) The active area of the DLP4500NIR device is surrounded by an aperture on the inside of the DMD window surface that masks structures of the DMD device assembly from normal view. The aperture is sized to anticipate several optical conditions. Overfill light illuminating the area outside the active array can scatter and create adverse effects to the performance of an end application using the DMD.  Design the illumination optical system as to limit light flux incident outside the active array to less than 10% of the light flux level in the active area. Depending on the particular system's optical architecture and assembly tolerances, the amount of overfill light on the outside of the active array may cause system performance degradation .
(17) The Micromirror array fill factor depends on numerous application-specific design variables, such as:
  • Illumination angle, plus angle tolerance
  • Illumination and projection aperture size, and location in the system optical path
(18) Conditions of Acceptance: All DMD image quality returns will be evaluated using the following projected image test conditions:
       Test set degamma shall be linear
       Test set brightness and contrast shall be set to nominal
       The diagonal size of the projected image shall be a minimum of 20 inches
       The projections screen shall be 1X gain
       The projected image shall be inspected from a 38 inch minimum viewing distance
       The image shall be in focus during all image quality tests
(19) Bright pixel definition: A single pixel or mirror that is stuck in the ON position and is visibly brighter than the surrounding pixels
(20) Gray 10 screen definition: All areas of the screen are colored with the following settings:
      Red = 10/255
      Green = 10/255
      Blue = 10/255
(21) POM definition: Rectangular border of off-state mirrors surrounding the active area
(22) Dark pixel definition: A single pixel or mirror that is stuck in the OFF position and is visibly darker than the surrounding pixels
(23) Adjacent pixel definition: Two or more stuck pixels sharing a common border or common point, also referred to as a cluster
(24) Unstable pixel definition: A single pixel or mirror that does not operate in sequence with parameters loaded into memory. The unstable pixel appears to be flickering asynchronously with the image