DLPS159D April 2019 – December 2024 DLP470NE
PRODUCTION DATA
- 1
- 1 Features
- 2 Applications
- 3 Description
- 4 Pin Configuration and Functions
-
5 Specifications
- 5.1 Absolute Maximum Ratings
- 5.2 Storage Conditions
- 5.3 ESD Ratings
- 5.4 Recommended Operating Conditions
- 5.5 Thermal Information
- 5.6 Electrical Characteristics
- 5.7 Capacitance at Recommended Operating Conditions
- 5.8 Timing Requirements
- 5.9 System Mounting Interface Loads
- 5.10 Micromirror Array Physical Characteristics
- 5.11 Micromirror Array Optical Characteristics
- 5.12 Window Characteristics
- 5.13 Chipset Component Usage Specification
- 6 Detailed Description
- 7 Application and Implementation
- 8 Power Supply Recommendations
- 9 Layout
- 10Device and Documentation Support
- 11Revision History
- Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
- FXH|257
Thermal pad, mechanical data (Package|Pins)
Orderable Information
4 Pin Configuration and Functions
Figure 4-1 Series 410257-pin FXHBottom View|
CAUTION:
To ensure reliable, long-term operation of the .47-inch 1080P s410 DMD, it is critical to properly manage the layout and operation of the signals identified in the table below. For specific details and guidelines, refer to the PCB Design Requirements for TI DLP Standard TRP Digital Micromirror Devices application report before designing the board. |
Table 4-1 Pin Functions
| PIN | I/O(3) | SIGNAL | DATA RATE |
INTERNAL TERMINATION |
DESCRIPTION | TRACE LENGTH (mil) |
|
|---|---|---|---|---|---|---|---|
| NAME | NO. | ||||||
| D_AN(0) | C6 | NC | LVDS | DDR | Differential | No connect | 805.0 |
| D_AN(1) | C3 | ||||||
| D_AN(2) | E1 | ||||||
| D_AN(3) | C4 | ||||||
| D_AN(4) | D1 | ||||||
| D_AN(5) | B8 | ||||||
| D_AN(6) | F4 | ||||||
| D_AN(7) | E3 | ||||||
| D_AN(8) | C11 | ||||||
| D_AN(9) | F3 | ||||||
| D_AN(10) | K4 | ||||||
| D_AN(11) | H3 | ||||||
| D_AN(12) | J3 | ||||||
| D_AN(13) | C13 | ||||||
| D_AN(14) | A5 | ||||||
| D_AN(15) | A3 | ||||||
| D_AP(0) | C7 | NC | LVDS | DDR | Differential | No connect | 805.0 |
| D_AP(1) | C2 | ||||||
| D_AP(2) | E2 | ||||||
| D_AP(3) | B4 | ||||||
| D_AP(4) | C1 | ||||||
| D_AP(5) | B7 | ||||||
| D_AP(6) | E4 | ||||||
| D_AP(7) | D3 | ||||||
| D_AP(8) | C12 | ||||||
| D_AP(9) | F2 | ||||||
| D_AP(10) | J4 | ||||||
| D_AP(11) | G3 | ||||||
| D_AP(12) | J2 | ||||||
| D_AP(13) | C14 | ||||||
| D_AP(14) | A6 | ||||||
| D_AP(15) | A4 | ||||||
| D_BN(0) | N4 | NC | LVDS | DDR | Differential | No connect | 805.0 |
| D_BN(1) | Z11 | ||||||
| D_BN(2) | W4 | ||||||
| D_BN(3) | W10 | ||||||
| D_BN(4) | L1 | ||||||
| D_BN(5) | V8 | ||||||
| D_BN(6) | W6 | ||||||
| D_BN(7) | M1 | ||||||
| D_BN(8) | R4 | ||||||
| D_BN(9) | W1 | ||||||
| D_BN(10) | U4 | ||||||
| D_BN(11) | V2 | ||||||
| D_BN(12) | Z5 | ||||||
| D_BN(13) | N3 | ||||||
| D_BN(14) | Z2 | ||||||
| D_BN(15) | L4 | ||||||
| D_BP(0) | M4 | NC | LVDS | DDR | Differential | No connect | 805.0 |
| D_BP(1) | Z12 | ||||||
| D_BP(2) | Z4 | ||||||
| D_BP(3) | Z10 | ||||||
| D_BP(4) | L2 | ||||||
| D_BP(5) | V9 | ||||||
| D_BP(6) | W7 | ||||||
| D_BP(7) | N1 | ||||||
| D_BP(8) | P4 | ||||||
| D_BP(9) | V1 | ||||||
| D_BP(10) | T4 | ||||||
| D_BP(11) | V3 | ||||||
| D_BP(12) | Z6 | ||||||
| D_BP(13) | N2 | ||||||
| D_BP(14) | Z3 | ||||||
| D_BP(15) | L3 | ||||||
| D_CN(0) | H27 | I | LVDS | DDR | Differential | Data negative | 805.0 |
| D_CN(1) | A20 | ||||||
| D_CN(2) | H28 | ||||||
| D_CN(3) | K28 | ||||||
| D_CN(4) | K30 | ||||||
| D_CN(5) | C23 | ||||||
| D_CN(6) | G27 | ||||||
| D_CN(7) | J30 | ||||||
| D_CN(8) | B24 | ||||||
| D_CN(9) | A21 | ||||||
| D_CN(10) | A27 | ||||||
| D_CN(11) | C29 | ||||||
| D_CN(12) | A26 | ||||||
| D_CN(13) | C25 | ||||||
| D_CN(14) | A29 | ||||||
| D_CN(15) | C30 | ||||||
| D_CP(0) | J27 | I | LVDS | DDR | Differential | Data positive | 805.0 |
| D_CP(1) | A19 | ||||||
| D_CP(2) | H29 | ||||||
| D_CP(3) | K27 | ||||||
| D_CP(4) | K29 | ||||||
| D_CP(5) | C22 | ||||||
| D_CP(6) | F27 | ||||||
| D_CP(7) | H30 | ||||||
| D_CP(8) | B25 | ||||||
| D_CP(9) | B21 | ||||||
| D_CP(10) | B27 | ||||||
| D_CP(11) | C28 | ||||||
| D_CP(12) | A25 | ||||||
| D_CP(13) | C24 | ||||||
| D_CP(14) | A28 | ||||||
| D_CP(15) | B30 | ||||||
| D_DN(0) | V25 | I | LVDS | DDR | Differential | Data negative | 805.0 |
| D_DN(1) | V28 | ||||||
| D_DN(2) | T30 | ||||||
| D_DN(3) | V27 | ||||||
| D_DN(4) | U30 | ||||||
| D_DN(5) | W23 | ||||||
| D_DN(6) | R27 | ||||||
| D_DN(7) | T28 | ||||||
| D_DN(8) | V20 | ||||||
| D_DN(9) | R28 | ||||||
| D_DN(10) | L27 | ||||||
| D_DN(11) | N28 | ||||||
| D_DN(12) | M28 | ||||||
| D_DN(13) | V18 | ||||||
| D_DN(14) | Z26 | ||||||
| D_DN(15) | Z28 | ||||||
| D_DP(0) | V24 | I | LVDS | DDR | Differential | Data positive | 805.0 |
| D_DP(1) | V29 | ||||||
| D_DP(2) | T29 | ||||||
| D_DP(3) | W27 | ||||||
| D_DP(4) | V30 | ||||||
| D_DP(5) | W24 | ||||||
| D_DP(6) | T27 | ||||||
| D_DP(7) | U28 | ||||||
| D_DP(8) | V19 | ||||||
| D_DP(9) | R29 | ||||||
| D_DP(10) | M27 | ||||||
| D_DP(11) | P28 | ||||||
| D_DP(12) | M29 | ||||||
| D_DP(13) | V17 | ||||||
| D_DP(14) | Z25 | ||||||
| D_DP(15) | Z27 | ||||||
| SCTRL_AN | G1 | NC | LVDS | DDR | Differential | No connect | 805.0 |
| SCTRL_AP | F1 | ||||||
| SCTRL_BN | V5 | ||||||
| SCTRL_BP | V4 | ||||||
| SCTRL_CN | C26 | I | LVDS | DDR | Differential | Serial control negative | 805.0 |
| SCTRL_CP | C27 | I | LVDS | DDR | Differential | Serial control positive | 805.0 |
| SCTRL_DN | P30 | I | LVDS | DDR | Differential | Serial control negative | 805.0 |
| SCTRL_DP | R30 | I | LVDS | DDR | Differential | Serial control positive | 805.0 |
| DCLK_AN | H2 | NC | LVDS | Differential | No connect | 805.0 | |
| DCLK_AP | H1 | ||||||
| DCLK_BN | V6 | ||||||
| DCLK_BP | V7 | ||||||
| DCLK_CN | D27 | I | LVDS | Differential | Clock negative | 805.0 | |
| DCLK_CP | E27 | I | LVDS | Differential | Clock positive | 805.0 | |
| DCLK_DN | N29 | I | LVDS | Differential | Clock negative | 805.0 | |
| DCLK_DP | N30 | I | LVDS | Differential | Clock positive | 805.0 | |
| SCPCLK | A10 | I | LVCMOS | Pull down | Serial communications port clock. Active only when SCPENZ is logic low | ||
| SCPDI | A12 | I | LVCMOS | SDR | Pull down | Serial communications port data input. Synchronous to SCPCLK rising edge | |
| SCPENZ | C10 | I | LVCMOS | Pull down | Serial communications port enable active low | ||
| SCPDO | A11 | O | LVCMOS | SDR | Serial communications port output | ||
| RESET_ADDR(0) | Z13 | I | LVCMOS | Pull down | Reset driver address select | ||
| RESET_ADDR(1) | W13 | ||||||
| RESET_ADDR(2) | V10 | ||||||
| RESET_ADDR(3) | W14 | ||||||
| RESET_MODE(0) | W9 | I | LVCMOS | Pull down | Reset driver mode select | ||
| RESET_SEL(0) | V14 | Reset driver level select | |||||
| RESET_SEL(1) | Z8 | Reset driver level select | |||||
| RESET_STROBE | Z9 | I | LVCMOS | Pull down | Rising edge latches in RESET_ADDR, RESET_MODE, and RESET_SEL | ||
| PWRDNZ | A8 | I | LVCMOS | Pull down | Active low device reset | ||
| RESET_OEZ | W15 | I | LVCMOS | Pull up | Active low output enable for internal reset driver circuits | ||
| RESET_IRQZ | V16 | O | LVCMOS | Active low output interrupt to DLP display controller | |||
| EN_OFFSET | C9 | O | LVCMOS | Active high enable for external VOFFSET regulator | |||
| PG_OFFSET | A9 | I | LVCMOS | Pull up | Active low fault from external VOFFSET regulator | ||
| TEMP_N | B18 | Analog | Temperature sensor diode cathode | ||||
| TEMP_P | B17 | Analog | Temperature sensor diode anode | ||||
| RESERVED | D12, D13, D14, D15, D16, D17, D18, D19, U12, U13, U14, U15 | NC | Analog | Pull Down | Do not connect on DLP system board. No connect. No electrical connections from CMOS bond pad to package pin | ||
| No Connect | U16, U17, U18, U19 | NC | No connect. No electrical connection from CMOS bond pad to package pin | ||||
| RESERVED_BA | W11 | O | LVCMOS | Do not connect on DLP system board. | |||
| RESERVED_BB | B11 | ||||||
| RESERVED_BC | Z20 | ||||||
| RESERVED_BD | C18 | ||||||
| RESERVED_PFE | A18 | I | LVCMOS | Pull down | Connect to ground on DLP system board. | ||
| RESERVED_TM | C8 | ||||||
| RESERVED_TP0 | Z19 | I | Analog | Do not connect on DLP system board. | |||
| RESERVED_TP1 | W20 | ||||||
| RESERVED_TP2 | W19 | ||||||
| VBIAS(1) | C15, C16, V11, V12 | P | Analog | Supply voltage for positive bias level of micromirror reset signal | |||
| VRESET(1) | G4, H4, J1, K1 | P | Analog | Supply voltage for negative reset level of micromirror reset signal | |||
| VOFFSET(1) | A30, B2, M30, Z1, Z30 | P | Analog | Supply voltage for HVCMOS logic. Supply voltage for positive offset level of micromirror reset signal. Supply voltage for stepped high voltage at micromirror address electrodes | |||
| VCC(1) | A24, A7, B10, B13, B16, B19, B22, B28, B5, C17, C20, D4, J29, K2, L29, M2, N27, U27, V13, V15, V22, W17, W21, W26, W29, W3, Z18, Z23, Z29, Z7 | P | Analog | Supply voltage for LVCMOS core. Supply voltage for positive offset level of micromirror reset signal during Power down. Supply voltage for normal high level at micromirror address electrodes | |||
| VSS(2) | A13, A22, A23, B12, B14, B15, B20, B23, B26, B29, B3, B6, B9, C19, C21, C5, D2, G2, J28, K3, L28, L30, M3, P27, P29, U29, V21, V23, V26, W12, W16, W18, W2, W22, W25, W28, W30, W5, W8, Z21, Z22, Z24 | G | Device ground. Common return for all power | ||||
(1) VBIAS, VCC, VOFFSET, and VRESET power supplies
must be connected for proper DMD operation.
(2) VSS must be connected for proper DMD operation.
(3) I = Input, O = Output, P = Power, G = Ground, NC = No connect