DLPS170B September   2020  – April 2022 DLP471TE

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Switching Characteristics
    8. 6.8  Timing Requirements
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Micromirror Array Physical Characteristics
    11. 6.11 Micromirror Array Optical Characteristics
    12. 6.12 Window Characteristics
    13. 6.13 Chipset Component Usage Specification
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Interface
      2. 7.3.2 Timing
    4. 7.4 Device Functional Modes
    5. 7.5 Optical Interface and System Image Quality Considerations
      1. 7.5.1 Numerical Aperture and Stray Light Control
      2. 7.5.2 Pupil Match
      3. 7.5.3 Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Temperature Sensor Diode
  9. 9 Power Supply Recommendations
    1. 9.1 DMD Power Supply Power-Up Procedure
    2. 9.2 DMD Power Supply Power-Down Procedure
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Impedance Requirements
    3. 10.3 Layers
    4. 10.4 Trace Width, Spacing
    5. 10.5 Power
    6. 10.6 Trace Length Matching Recommendations
  11. 11Device and Documentation Support
    1. 11.1 Third-Party Products Disclaimer
    2. 11.2 Device Support
      1. 11.2.1 Device Nomenclature
      2. 11.2.2 Device Markings
    3. 11.3 Documentation Support
      1. 11.3.1 Related Documentation
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.6 Trace Length Matching Recommendations

Table 10-4 and Table 10-5 describe recommended signal trace length matching requirements. Follow these guidelines to avoid routing long traces over large areas of the PCB:

  • Match the trace lengths so that longer signals route in a serpentine pattern
  • Minimize the number of turns.
  • Ensure that the turn angles no sharper than 45 degrees.

Figure 10-1 shows an example of the HSSI signal pair routing.

Signals listed in Table 10-4 are specified fro data rate operation at up to 3.2 Gbps. Minimize the layer changes for these signals. Minimize the number of vias. Avoid sharp turns and layer switching while minimizing the lengths. When layer changes are necessary, place GND vias around the signal vias to provide a signal return path. The distance from one pair of differential signals to another must be at least 2 times the distance within the pair.

Table 10-4 HSSI High Speed DMD Data Signals
SIGNAL NAMEREFERENCE SIGNALROUTING SPECIFICATIONUNIT
DMD_HSSI0_N(0...7),
DMD_HSSI0_P(0...7)		DMD_HSSI0_CLK_N,
DMD_HSSI_CLK_P		±0.25inch
DMD_HSSI1_N(0...7),
DMD_HSSI1_P(0...7)		DMD_HSSI0_CLK_N,
DMD_HSSI_CLK_P		±0.25inch
DMD_HSSI0_CLK_PDMD_HSSI1_CLK_P±0.05inch
Intra-pair PIntra-pair N±0.01inch
Table 10-5 Other Timing Critical Signals
SIGNAL NAMEConstraintsRouting Layers
LS_CLK_P, LS_CLK_N
LS_WDATA_P, LS_WDATA_N
LS_RDATA_A		Intra-pair (P to N)
Matched to 0.01 inches
Signal-to-signal
Matched to +/- 0.25 inches		Layers 3, 8
GUID-12CFA56B-4159-467B-8A26-FC6AA85B2879-low.gifFigure 10-1 Example HSSI PCB Routing