DLPS173B august   2020  – july 2023 DLP471TP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Switching Characteristics
    8. 6.8  Timing Requirements
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Micromirror Array Physical Characteristics
    11. 6.11 Micromirror Array Optical Characteristics
    12. 6.12 Window Characteristics
    13. 6.13 Chipset Component Usage Specification
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Interface
      2. 7.3.2 Timing
    4. 7.4 Device Functional Modes
    5. 7.5 Optical Interface and System Image Quality Considerations
      1. 7.5.1 Numerical Aperture and Stray Light Control
      2. 7.5.2 Pupil Match
      3. 7.5.3 Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Power Density Calculation
    8. 7.8 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.8.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.8.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.8.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.8.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Temperature Sensor Diode
  10. 9 Power Supply Recommendations
    1. 9.1 DMD Power Supply Power-Up Procedure
    2. 9.2 DMD Power Supply Power-Down Procedure
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Impedance Requirements
    3. 10.3 Layers
    4. 10.4 Trace Width, Spacing
    5. 10.5 Power
    6. 10.6 Trace Length Matching Recommendations
  12. 11Device and Documentation Support
    1. 11.1 Third-Party Products Disclaimer
    2. 11.2 Device Support
      1. 11.2.1 Device Nomenclature
      2. 11.2.2 Device Markings
    3. 11.3 Documentation Support
      1. 11.3.1 Related Documentation
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.8 Timing Requirements

Over operating free-air temperature range and supply voltages (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
LVCMOS
tr Rise time(1) 20% to 80% reference points 25 ns
tf Fall time(1) 80% to 20% reference points 25 ns
LOW SPEED INTERFACE (LSIF)
tr Rise time(2) 20% to 80% reference points 450 ps
tf Fall time(2) 80% to 20% reference points 450 ps
tW(H) Pulse duration high(3) LS_CLK. 50% to 50% reference points 3.1 ns
tW(L) Pulse duration low(3) LS_CLK. 50% to 50% reference points 3.1 ns
tsu Setup time(4) LS_WDATA valid before rising edge of LS_CLK (differential) 1.5 ns
th Hold time(4) LS_WDATA valid after rising edge of LS_CLK (differential) 1.5 ns
HIGH SPEED SERIAL INTERFACE (HSSI)
tr Rise time - data(5)(6) From –A1 to A1 minimum eye height specification 50 115 ps
Rise time - clock(5)(6) From –A1 to A1 minimum eye height specification 50 135 ps
tf Fall time — data(5)(6) From A1 to –A1 minimum eye height specification 50 115 ps
Fall time — clock(5)(6) From A1 to –A1 minimum eye height specification 50 135 ps
tW(H) Pulse duration high(7) DCLK. 50% to 50% reference points 0.275 ns
tW(L) Pulse duration low(7) DCLK. 50% to 50% reference points 0.275 ns
(1) See Figure 6-9 for rise time and fall time for LVCMOS.
(2) See Figure 6-4 for rise time and fall time for LSIF.
(3) See Figure 6-4  for pulse duration high and low time for LSIF.
(4) See Figure 6-4  for setup and hold time for LSIF.
(5) See Figure 6-11 for rise time and fall time for HSSI Eye Characteristics.
(6) See  Figure 6-12 for rise time and fall time for HSSI.
(7) See  Figure 6-12 for pulse duration high and low for HSSI.
GUID-5CA0ED5E-D0C1-485E-A292-C912DD9868CB-low.gif Figure 6-3 LSIF Waveform Requirements
Equation 1. GUID-86B70B5E-DEAE-4ED5-B3F9-D4596C9C56FE-low.gif
Equation 2. GUID-CB0A55B8-52F7-4156-BD0E-A21B0595BED6-low.gif
GUID-2EE69D6B-AC4A-408F-AFA4-D71D8FDB3206-low.gif Figure 6-4 LSIF Timing Requirements
GUID-8616ADC2-8D7E-46B3-B2DB-8B075FE85712-low.gif Figure 6-5 LSIF Rise, Fall Time Slew
GUID-57B460D6-0AD2-4F71-B977-AF9F3703758E-low.gif Figure 6-6 LSIF Voltage Requirements
GUID-80205C3F-761A-4FCB-8CCB-C29AB5AEF679-low.gif Figure 6-7 LSIF Equivalent Input
GUID-20201210-CA0I-RLZM-FNQW-JTN2JG094DCZ-low.gif Figure 6-8 LVCMOS Input Hysteresis
GUID-F20A2AC3-4B58-42A2-99F2-859E3F9A17E2-low.gif Figure 6-9 LVCMOS Rise, Fall Time Slew Rate
GUID-F1DA5057-BD3C-4AAB-AC99-A4219A84190A-low.gif Figure 6-10 HSSI Waveform Requirements
Equation 3. GUID-EFBAB21F-9428-401B-AD12-063D5AB10813-low.gif
Equation 4. GUID-232DD7CF-78C5-44F9-94BB-B02F47CE52B9-low.gif
GUID-ED3E7D9B-9FFA-4ACD-90D7-4539590680C0-low.gif Figure 6-11 HSSI Eye Characteristics
GUID-E61A1625-4B78-408A-812C-7E0293CB5151-low.gif Figure 6-12 HSSI CLK Characteristics