DLPS173B august   2020  – july 2023 DLP471TP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Switching Characteristics
    8. 6.8  Timing Requirements
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Micromirror Array Physical Characteristics
    11. 6.11 Micromirror Array Optical Characteristics
    12. 6.12 Window Characteristics
    13. 6.13 Chipset Component Usage Specification
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Interface
      2. 7.3.2 Timing
    4. 7.4 Device Functional Modes
    5. 7.5 Optical Interface and System Image Quality Considerations
      1. 7.5.1 Numerical Aperture and Stray Light Control
      2. 7.5.2 Pupil Match
      3. 7.5.3 Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Power Density Calculation
    8. 7.8 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.8.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.8.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.8.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.8.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Temperature Sensor Diode
  10. 9 Power Supply Recommendations
    1. 9.1 DMD Power Supply Power-Up Procedure
    2. 9.2 DMD Power Supply Power-Down Procedure
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Impedance Requirements
    3. 10.3 Layers
    4. 10.4 Trace Width, Spacing
    5. 10.5 Power
    6. 10.6 Trace Length Matching Recommendations
  12. 11Device and Documentation Support
    1. 11.1 Third-Party Products Disclaimer
    2. 11.2 Device Support
      1. 11.2.1 Device Nomenclature
      2. 11.2.2 Device Markings
    3. 11.3 Documentation Support
      1. 11.3.1 Related Documentation
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.7 Micromirror Power Density Calculation

The calculation of the optical power density of the illumination on the DMD in the different wavelength bands uses the total measured optical power on the DMD, percent illumination overfill, area of the active array, and ratio of the spectrum in the wavelength band of interest to the total spectral optical power.

  • ILLUV = [OPUV-RATIO × QINCIDENT] × 1000 ÷ AILL (mW/cm2)
  • ILLVIS = [OPVIS-RATIO × QINCIDENT] ÷ AILL (W/cm2)
  • ILLIR = [OPIR-RATIO × QINCIDENT] × 1000 ÷ AILL (mW/cm2)
  • ILLBLU = [OPBLU-RATIO × QINCIDENT] ÷ AILL (W/cm2)
  • ILLBLU1 = [OPBLU1-RATIO × QINCIDENT] ÷ AILL (W/cm2)
  • AILL = AARRAY ÷ (1 ­- OVILL) (cm2)

where:

  • ILLUV = UV illumination power density on the DMD (mW/cm2)
  • ILLVIS = VIS illumination power density on the DMD (W/cm2)
  • ILLIR = IR illumination power density on the DMD (mW/cm2)
  • ILLBLU = BLU illumination power density on the DMD (W/cm2)
  • ILLBLU1 = BLU1 illumination power density on the DMD (W/cm2)
  • AILL = illumination area on the DMD (cm2)
  • QINCIDENT = total incident optical power on DMD (W) (measured)
  • AARRAY = area of the array (cm 2) (data sheet)
  • OVILL = percent of total illumination on the DMD outside the array (%) (optical model)
  • OPUV-RATIO = ratio of the optical power for wavelengths <410 nm to the total optical power in the illumination spectrum (spectral measurement)
  • OPVIS-RATIO = ratio of the optical power for wavelengths ≥410 and ≤800 nm to the total optical power in the illumination spectrum (spectral measurement)
  • OPIR-RATIO = ratio of the optical power for wavelengths >800 nm to the total optical power in the illumination spectrum (spectral measurement)
  • OPBLU-RATIO = ratio of the optical power for wavelengths ≥410 and ≤475 nm to the total optical power in the illumination spectrum (spectral measurement)
  • OPBLU1-RATIO = ratio of the optical power for wavelengths ≥410 and ≤445 nm to the total optical power in the illumination spectrum (spectral measurement)

The illumination area varies and depends on the illumination overfill. The total illumination area on the DMD is the array area and overfill area around the array. The optical model is used to determine the percent of the total illumination on the DMD that is outside the array (OVILL) and the percent of the total illumination that is on the active array. From these values the illumination area (AILL) is calculated. The illumination is assumed to be uniform across the entire array.

From the measured illumination spectrum, the ratio of the optical power in the wavelength bands of interest to the total optical power is calculated.

Sample calculation:

QINCIDENT = 9.40 W (measured)
AARRAY = (1.0368 × 0.5832) = 0.6047 cm2 (data sheet)
OVILL = 16.3% (optical model)
OPUV-RATIO = 0.00021 (spectral measurement)
OPVIS-RATIO = 0.99977 (spectral measurement)
OPIR-RATIO = 0.00002 (spectral measurement)
OPBLU-RATIO = 0.28100 (spectral measurement)
OPBLU1-RATIO = 0.03200 (spectral measurement)
AILL = 0.6047 ÷ (1 - 0.163) = 0.7224 cm2
ILLUV = [0.00021 × 9.40W] × 1000 ÷ 0.7224 cm2 = 2.732 mW/cm2
ILLVIS = [0.99977 × 9.40W] ÷ 0.7224 cm2 = 13.01 W/cm2
ILLIR = [0.00002 × 9.40W] × 1000 ÷ 0.7224 cm2 = 0.260 mW/cm2
ILLBLU = [0.28100 × 9.40W] ÷ 0.7224 cm2 = 3.66 W/cm2
ILLBLU1 = [0.03200 × 9.40W] ÷ 0.7224 cm2 = 0.42 W/cm2