DLPS273A May   2024  – December 2024 DLP472TE

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Storage Conditions
    3. 5.3  ESD Ratings
    4. 5.4  Recommended Operating Conditions
    5.     11
    6.     12
    7. 5.5  Thermal Information
    8. 5.6  Electrical Characteristics
    9. 5.7  Switching Characteristics
    10. 5.8  Timing Requirements
    11. 5.9  System Mounting Interface Loads
    12. 5.10 Micromirror Array Physical Characteristics
    13. 5.11 Micromirror Array Optical Characteristics
    14. 5.12 Window Characteristics
    15. 5.13 Chipset Component Usage Specification
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power Interface
      2. 6.3.2 Timing
    4. 6.4 Device Functional Modes
    5. 6.5 Optical Interface and System Image Quality Considerations
      1. 6.5.1 Numerical Aperture and Stray Light Control
      2. 6.5.2 Pupil Match
      3. 6.5.3 Illumination Overfill
    6. 6.6 Micromirror Array Temperature Calculation
    7. 6.7 Micromirror Power Density Calculation
    8. 6.8 Window Aperture Illumination Overfill Calculation
    9. 6.9 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 6.9.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 6.9.2 Landed Duty Cycle and Useful Life of the DMD
      3. 6.9.3 Landed Duty Cycle and Operational DMD Temperature
      4. 6.9.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Temperature Sensor Diode
  9. 8 Power Supply Recommendations
    1. 8.1 DMD Power Supply Power-Up Procedure
    2. 8.2 DMD Power Supply Power-Down Procedure
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Impedance Requirements
    3. 9.3 Layers
    4. 9.4 Trace Width, Spacing
    5. 9.5 Power
    6. 9.6 Trace Length Matching Recommendations
  11. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Device Support
      1. 10.2.1 Device Nomenclature
      2. 10.2.2 Device Markings
    3. 10.3 Documentation Support
      1. 10.3.1 Related Documentation
    4. 10.4 Receiving Notification of Documentation Updates
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.11 Micromirror Array Optical Characteristics

PARAMETERTEST CONDITIONSMINTYPMAXUNIT
Micromirror tilt angle (1)(2)(3)(4)Landed state13.514.515.5degrees
Micromirror crossover time (5)Typical performance3μs
Micromirror switching time (6)Typical performance6
Image performance(7)Bright pixel(s) in active area (8)Gray 10 Screen (9)0micromirrors
Bright pixel(s) in the POM (10)Gray 10 Screen (9)1
Dark pixel(s) in the active area (11)White Screen4
Adjacent pixel(s) (12)Any Screen0
Unstable pixel(s) in active area (13)Any Screen0
(1) Measured relative to the plane formed by the overall micromirror array.
(2) Represents the variation that can occur between any two individual micromirrors, located on the same device or located on different devices.
(3) For some applications, it is critical to account for the micromirror tilt angle variation in the overall system optical design. With some system optical designs, the micromirror tilt angle variation within a device may result in perceivable non-uniformities in the light field reflected from the micromirror array. With some system optical designs, the micromirror tilt angle variation between devices may result in colorimetry variations, system efficiency variations or system contrast variations.
(4) When the micromirror array is landed (not parked), the tilt direction of each individual micromirror is dictated by the binary contents of the CMOS memory cell associated with each individual micromirror. A binary value of 1 results in a micromirror landing in the ON State direction. A binary value of 0 results in a micromirror landing in the OFF State direction.
(5) The time required for a micromirror to nominally transition from one landed state to the opposite landed state.
(6) The minimum time between successive transitions of a micromirror.
(7) Conditions of Acceptance: All DMD image quality returns will be evaluated using the following projected image test conditions:       
       Test set degamma shall be linear.
       Test set brightness and contrast shall be set to nominal.
       The diagonal size of the projected image shall be a minimum of 60 inches.
       The projections screen shall be 1X gain.
       The projected image shall be inspected from a 8 foot minimum viewing distance.
       The image shall be in focus during all image quality tests.
(8) Bright pixel definition: A single pixel or mirror that is stuck in the ON position and is visibly brighter than the surrounding pixels.
(9) Gray 10 screen definition: All areas of the screen are colored with the following settings:
      Red = 10/255
      Green = 10/255
      Blue = 10/255
(10) POM definition: Rectangular border of off-state mirrors surrounding the active area.
(11) Dark pixel definition: A single pixel or mirror that is stuck in the OFF position and is visibly darker than the surrounding pixels.
(12) Adjacent pixel definition: Two or more stuck pixels sharing a common border or common point, also referred to as a cluster.
(13) Unstable pixel definition: A single pixel or mirror that does not operate in sequence with parameters loaded into memory. The unstable pixel appears to be flickering asynchronously with the image.