DLPS247
August 2024
DLP472TP
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
4.1
Pin Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
Storage Conditions
5.3
ESD Ratings
5.4
Recommended Operating Conditions
12
5.5
Thermal Information
5.6
Electrical Characteristics
5.7
Switching Characteristics
5.8
Timing Requirements
17
5.9
System Mounting Interface Loads
19
5.10
Micromirror Array Physical Characteristics
21
5.11
Micromirror Array Optical Characteristics
23
5.12
Window Characteristics
5.13
Chipset Component Usage Specification
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
Power Interface
6.3.2
LPSDR Low-Speed Interface
6.3.3
High-Speed Interface
6.3.4
Timing
6.4
Device Functional Modes
6.5
Optical Interface and System Image Quality Considerations
6.5.1
Numerical Aperture and Stray Light Control
6.5.2
Pupil Match
6.5.3
Illumination Overfill
6.6
Micromirror Array Temperature Calculation
6.7
Micromirror Power Density Calculation
6.8
Micromirror Landed-On/Landed-Off Duty Cycle
6.8.1
Definition of Micromirror Landed-On/Landed-Off Duty Cycle
6.8.2
Landed Duty Cycle and Useful Life of the DMD
6.8.3
Landed Duty Cycle and Operational DMD Temperature
6.8.4
Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
7
Application and Implementation
7.1
Application Information
7.2
Typical Application
7.2.1
Design Requirements
7.2.2
Detailed Design Procedure
7.2.3
Application Curve
7.3
Temperature Sensor Diode
8
Power Supply Recommendations
8.1
DMD Power Supply Power-Up Procedure
8.2
DMD Power Supply Power-Down Procedure
9
Layout
9.1
Layout Guidelines
9.2
Layout Example
10
Device and Documentation Support
10.1
Third-Party Products Disclaimer
10.2
Device Support
10.2.1
Device Nomenclature
10.2.2
Device Markings
10.3
Documentation Support
10.3.1
Related Documentation
10.4
Receiving Notification of Documentation Updates
10.5
Trademarks
10.6
Electrostatic Discharge Caution
10.7
Glossary
11
Revision History
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
FQY|174
MCLG050
Thermal pad, mechanical data (Package|Pins)
Orderable Information
dlps247_oa
dlps247_pm
10
Device and Documentation Support