DLPS193A
November 2020 – July 2022
DLP500YX
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
Storage Conditions
6.3
ESD Ratings
6.4
Recommended Operating Conditions
6.5
Thermal Information
6.6
Electrical Characteristics
6.7
Capacitance at Recommended Operating Conditions
6.8
Timing Requirements
6.9
Typical Characteristics
6.10
System Mounting Interface Loads
6.11
Micromirror Array Physical Characteristics
6.12
Micromirror Array Optical Characteristics
6.13
Window Characteristics
6.14
Chipset Component Usage Specification
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Power Interface
7.3.2
Timing
7.4
Device Functional Modes
7.5
Optical Interface and System Image Quality Considerations
7.5.1
Numerical Aperture and Stray Light Control
7.5.2
Pupil Match
7.5.3
Illumination Overfill
7.6
Micromirror Array Temperature Calculation
7.6.1
Micromirror Array Temperature Calculation using Illumination Power Density
7.6.2
Micromirror Array Temperature Calculation using Total Illumination Power
7.6.3
Micromirror Array Temperature Calculation using Screen Lumens
7.7
Micromirror Landed-On/Landed-Off Duty Cycle
7.7.1
Definition of Micromirror Landed-On/Landed-Off Duty Cycle
7.7.2
Landed Duty Cycle and Useful Life of the DMD
7.7.3
Landed Duty Cycle and Operational DMD Temperature
7.7.4
Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.3
DMD Die Temperature Sensing
9
Power Supply Recommendations
9.1
DMD Power Supply Power-Up Procedure
9.2
DMD Power Supply Power-Down Procedure
9.3
Restrictions on Hot Plugging and Hot Swapping
9.3.1
No Hot Plugging
9.3.2
No Hot Swapping
9.3.3
Intermittent or Voltage Power Spike Avoidance
10
Layout
10.1
Layout Guidelines
10.1.1
Critical Signal Guidelines
10.1.2
Power Connection Guidelines
10.1.3
Noise Coupling Avoidance
10.2
Layout Example
10.2.1
Layers
10.2.2
Impedance Requirements
10.2.3
Trace Width, Spacing
10.2.3.1
Voltage Signals
11
Device and Documentation Support
11.1
Third-Party Products Disclaimer
11.2
Device Support
11.2.1
Device Nomenclature
11.2.2
Device Markings
11.3
Documentation Support
11.3.1
Related Documentation
11.4
Receiving Notification of Documentation Updates
11.5
Support Resources
11.6
Trademarks
11.7
Electrostatic Discharge Caution
11.8
Glossary
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
FXK|257
MCLG042
Thermal pad, mechanical data (Package|Pins)
Orderable Information
dlps193a_oa
7
Detailed Description