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DLP5500 DLP 0.55-Inch XGA Series 450 Digital Micromirror Device
DLPS013H
April 2010 – December 2024
DLP5500
PRODUCTION DATA
CONTENTS
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DLP5500 DLP 0.55-Inch XGA Series 450 Digital Micromirror Device
1
1
Features
2
Applications
3
Description
4
Description (continued)
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
Storage Conditions
6.3
ESD Ratings
6.4
Recommended Operating Conditions
6.5
Thermal Information
6.6
Electrical Characteristics
6.7
Timing Requirements
6.8
System Mounting Interface Loads
6.9
Micromirror Array Physical Characteristics
6.10
Micromirror Array Optical Characteristics
6.11
Window Characteristics
6.12
Chipset Component Usage Specification
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.4
Device Functional Modes
7.4.1
Video Modes
7.4.2
Structured Light Modes
7.4.2.1
Static Image Buffer Mode
7.4.2.2
Real Time Structured Light Mode
7.5
Window Characteristics and Optics
7.5.1
Optical Interface and System Image Quality
7.5.2
Numerical Aperture and Stray Light Control
7.5.3
Pupil Match
7.5.4
Illumination Overfill
7.6
Micromirror Array Temperature Calculation
7.6.1
Package Thermal Resistance
7.6.2
Case Temperature
7.6.3
Micromirror Array Temperature Calculation for Uniform Illumination
7.7
Micromirror Landed-on/Landed-Off Duty Cycle
7.7.1
Definition of Micromirror Landed-On/Landed-Off Duty Cycle
7.7.2
Landed Duty Cycle and Useful Life of the DMD
7.7.3
Landed Duty Cycle and Operational DMD Temperature
7.7.4
Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
DLP5500 System Interface
9
Power Supply Recommendations
9.1
DMD Power-Up and Power-Down Procedures
10
Layout
10.1
Layout Guidelines
10.1.1
Impedance Requirements
10.1.2
PCB Signal Routing
10.1.3
Fiducials
10.2
Layout Example
11
Device and Documentation Support
11.1
Device Support
11.1.1
Device Nomenclature
11.2
Documentation Support
11.2.1
Related Documentation
11.3
Related Documentation
11.4
Support Resources
11.5
Trademarks
11.6
Electrostatic Discharge Caution
11.7
Glossary
12
Revision History
13
Mechanical, Packaging, and Orderable Information
IMPORTANT NOTICE
Package Options
Mechanical Data (Package|Pins)
FYA|149
MCLG018B
Thermal pad, mechanical data (Package|Pins)
Orderable Information
dlps013h_oa
dlps013h_pm
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Data Sheet
DLP5500 DLP 0.55-Inch XGA Series 450 Digital Micromirror Device
1
Features
0.55-inch micromirror array diagonal
1024 × 768 array of aluminum, micrometer-sized mirrors (XGA resolution)
10.8µm micromirror pitch
±12° micromirror tilt angle
(relative to flat state)
Designed for corner illumination
Designed for use with broadband visible light (420nm–700nm):
Window transmission 97% (single pass, through two window surfaces)
Micromirror reflectivity 88%
Array diffraction efficiency 86%
Array fill factor 92%
16-bit, low voltage differential signaling (LVDS) double data rate (DDR) input data bus
200 MHz input data clock rate
Dedicated DLPC200 controller for high-speed pattern rates:
5,000Hz (1-bit binary patterns)
500Hz (8-bit grayscale patterns)
Dedicated DLPC900 controller for high-speed pattern rates:
10,638.298Hz (1-bit binary patterns)
266.453Hz (8-bit grayscale patterns)
Series 450 package characteristics:
Thermal area 18mm × 12mm enabling high on-screen lumens (>2000lm)
149 micro pin grid array robust electrical connection
Package mates to Amphenol Intercon Systems 450-2.700-L-13.25-149 socket
2
Applications
Industrial
3D scanners for machine vision and quality control
3D printing
Direct imaging lithography
Laser marking and repair
Industrial and medical imaging
Medical instrumentation
Digital exposure systems
Medical
Opthamology
3D scanners for limb and skin measurement
Hyperspectral imaging
Displays
3D imaging microscopes
Intelligent and adaptive lighting