DLPS013H April   2010  – December 2024 DLP5500

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Description (continued)
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  System Mounting Interface Loads
    9. 6.9  Micromirror Array Physical Characteristics
    10. 6.10 Micromirror Array Optical Characteristics
    11. 6.11 Window Characteristics
    12. 6.12 Chipset Component Usage Specification
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Video Modes
      2. 7.4.2 Structured Light Modes
        1. 7.4.2.1 Static Image Buffer Mode
        2. 7.4.2.2 Real Time Structured Light Mode
    5. 7.5 Window Characteristics and Optics
      1. 7.5.1 Optical Interface and System Image Quality
      2. 7.5.2 Numerical Aperture and Stray Light Control
      3. 7.5.3 Pupil Match
      4. 7.5.4 Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
      1. 7.6.1 Package Thermal Resistance
      2. 7.6.2 Case Temperature
      3. 7.6.3 Micromirror Array Temperature Calculation for Uniform Illumination
    7. 7.7 Micromirror Landed-on/Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 DLP5500 System Interface
  10. 9 Power Supply Recommendations
    1. 9.1 DMD Power-Up and Power-Down Procedures
  11. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Impedance Requirements
      2. 10.1.2 PCB Signal Routing
      3. 10.1.3 Fiducials
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Documentation
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.10 Micromirror Array Optical Characteristics

TI assumes no responsibility for end-equipment optical performance. Achieving the desired end-equipment optical performance involves making trade-offs between numerous component and system design parameters. See the Application Notes for additional details, considerations, and guidelines: TI DLP® System Design: Optical Module Specifications.

PARAMETERCONDITIONSMINNOMMAXUNIT
Micromirror tilt angle, aDMD parked state(1)(2)(3), see Figure 7-3.0degrees
DMD landed state(1)(4)(5), see Figure 7-3.12
Micromirror tilt angle variation, b(1)(4)(6)(7)(8)See Figure 7-3.–11degrees
Micromirror Cross Over Time(10)1622µs
Micromirror Switching Time(11)140µs
Non-operating micromirrors(12)Non-adjacent micromirrors10micromirrors
Adjacent micromirrors0
Orientation of the micromirror axis-of-rotation(9)See .444546degrees
Micromirror array optical efficiency(13)(14)420 – 700, with all micromirrors in the ON state68%nm
Mirror metal specular reflectivity420 – 70089.4%nm
(1) Measured relative to the plane formed by the overall micromirror array
(2) Parking the micromirror array returns all of the micromirrors to an essentially flat (0°) state (as measured relative to the plane formed by the overall micromirror array).
(3) When the micromirror array is parked, the tilt angle of each individual micromirror is uncontrolled.
(4) Additional variation exists between the micromirror array and the package datums, as shown in the packaging section at the end of the document.
(5) When the micromirror array is landed, the tilt angle of each individual micromirror is dictated by the binary contents of the CMOS memory cell associated with each individual micromirror. A binary value of 1 will result in a micromirror landing in an nominal angular position of +12 degrees. A binary value of 0 will result in a micromirror landing in an nominal angular position of –12 degrees.
(6) Represents the landed tilt angle variation relative to the Nominal landed tilt angle.
(7) Represents the variation that can occur between any two individual micromirrors, located on the same device or located on different devices.
(8) For some applications, it is critical to account for the micromirror tilt angle variation in the overall System Optical Design. With some System Optical Designs, the micromirror tilt angle variations within a device may result in perceivable non-uniformities in the light field reflected from the micromirror array. With some System Optical Designs, the micromirror tilt angle variation between devices may result in colorimetry variations and/or system contrast variations.
(9) Measured relative to the package datums B and C, shown in the Section 13 section at the end of this document.
(10) Micromirror Cross Over time is primarily a function of the natural response time of the micromirrors.
(11) Micromirror switching is controlled and coordinated by the DLPC200 (see DLPS014), DLPA200, and DLPS015). Nominal Switching time depends on the system implementation and represents the time for the entire micromirror array to be refreshed.
(12) Non-operating micromirror is defined as a micromirror that is unable to transition nominally from the –12 degree position to +12 degree or vice versa.
(13) The minimum or maximum DMD optical efficiency observed in a specific application depends on numerous application-specific design variables, such as but not limited to:
  • Illumination wavelength, bandwidth or line-width, degree of coherence
  • Illumination angle, plus angle tolerance
  • Illumination and projection aperture size, and location in the system optical path
  • IIlumination overfill of the DMD micromirror array
  • Aberrations present in the illumination source and/or path
  • Aberrations present in the projection path
The specified nominal DMD optical efficiency is based on the following use conditions:
  • Visible illumination (420nm – 700nm)
  • Input illumination optical axis oriented at 24° relative to the window normal
  • Projection optical axis oriented at 0° relative to the window normal
  • f/3.0 illumination aperture
  • f/2.4 projection aperture
Based on these use conditions, the nominal DMD optical efficiency results from the following four components:
  • Micromirror array fill factor: nominally 92%
  • Micromirror array diffraction efficiency: nominally 86%
  • Micromirror surface reflectivity: nominally 88%
  • Window transmission: nominally 97% (single pass, through two surface transitions)
(14) Does not account for the effect of micromirror switching duty cycle, which is application dependent. Micromirror switching duty cycle represents the percentage of time that the micromirror is actually reflecting light from the optical illumination path to the optical projection path. This duty cycle depends on the illumination aperture size, the projection aperture size, and the micromirror array update rate.
DLP5500 Micromirror Landed Orientation and Tilt
Refer to section Micromirror Array Physical Characteristics table for M, N, and P specifications.
Figure 6-12 Micromirror Landed Orientation and Tilt