DLPS013H April   2010  – December 2024 DLP5500

PRODUCTION DATA  

1.   1
2. 1 Features
3. 2 Applications
4. 3 Description
5. 4 Description (continued)
6. 5 Pin Configuration and Functions
7. 6 Specifications
   1. 6.1  Absolute Maximum Ratings
   2. 6.2  Storage Conditions
   3. 6.3  ESD Ratings
   4. 6.4  Recommended Operating Conditions
   5. 6.5  Thermal Information
   6. 6.6  Electrical Characteristics
   7. 6.7  Timing Requirements
   8. 6.8  System Mounting Interface Loads
   9. 6.9  Micromirror Array Physical Characteristics
   10. 6.10 Micromirror Array Optical Characteristics
   11. 6.11 Window Characteristics
   12. 6.12 Chipset Component Usage Specification
8. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Feature Description
   4. 7.4 Device Functional Modes
      1. 7.4.1 Video Modes
      2. 7.4.2 Structured Light Modes
         1. 7.4.2.1 Static Image Buffer Mode
         2. 7.4.2.2 Real Time Structured Light Mode
   5. 7.5 Window Characteristics and Optics
      1. 7.5.1 Optical Interface and System Image Quality
      2. 7.5.2 Numerical Aperture and Stray Light Control
      3. 7.5.3 Pupil Match
      4. 7.5.4 Illumination Overfill
   6. 7.6 Micromirror Array Temperature Calculation
      1. 7.6.1 Package Thermal Resistance
      2. 7.6.2 Case Temperature
      3. 7.6.3 Micromirror Array Temperature Calculation for Uniform Illumination
   7. 7.7 Micromirror Landed-on/Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
9. 8 Application and Implementation
   1. 8.1 Application Information
   2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
         1. 8.2.2.1 DLP5500 System Interface
10. 9 Power Supply Recommendations
    1. 9.1 DMD Power-Up and Power-Down Procedures
11. 10Layout
    1. 10.1 Layout Guidelines
       1. 10.1.1 Impedance Requirements
       2. 10.1.2 PCB Signal Routing
       3. 10.1.3 Fiducials
    2. 10.2 Layout Example
12. 11Device and Documentation Support
    1. 11.1 Device Support
       1. 11.1.1 Device Nomenclature
    2. 11.2 Documentation Support
       1. 11.2.1 Related Documentation
    3. 11.3 Related Documentation
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
13. 12Revision History
14. 13Mechanical, Packaging, and Orderable Information