DLPS013H April   2010  – December 2024 DLP5500

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Description (continued)
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  System Mounting Interface Loads
    9. 6.9  Micromirror Array Physical Characteristics
    10. 6.10 Micromirror Array Optical Characteristics
    11. 6.11 Window Characteristics
    12. 6.12 Chipset Component Usage Specification
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Video Modes
      2. 7.4.2 Structured Light Modes
        1. 7.4.2.1 Static Image Buffer Mode
        2. 7.4.2.2 Real Time Structured Light Mode
    5. 7.5 Window Characteristics and Optics
      1. 7.5.1 Optical Interface and System Image Quality
      2. 7.5.2 Numerical Aperture and Stray Light Control
      3. 7.5.3 Pupil Match
      4. 7.5.4 Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
      1. 7.6.1 Package Thermal Resistance
      2. 7.6.2 Case Temperature
      3. 7.6.3 Micromirror Array Temperature Calculation for Uniform Illumination
    7. 7.7 Micromirror Landed-on/Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 DLP5500 System Interface
  10. Power Supply Recommendations
    1. 9.1 DMD Power-Up and Power-Down Procedures
  11. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Impedance Requirements
      2. 10.1.2 PCB Signal Routing
      3. 10.1.3 Fiducials
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Documentation
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Pin Configuration and Functions

DLP5500 FYA Package149-Pin CPGA Series 450Bottom ViewFigure 5-1 FYA Package149-Pin CPGA Series 450Bottom View
Table 5-1 Pin Functions
PIN(1)TYPE
(I/O/P )
SIGNALDATA
RATE(2)
INTERNAL
TERM(3)
CLOCKDESCRIPTIONTRACE
(mils)(4)
NAMENO.
DATA INPUTS
D_AN1G20InputLVCMOSDDRDifferentialDCLK_AInput data bus A (LVDS)715
D_AP1H20InputLVCMOSDDRDifferentialDCLK_A744
D_AN3H19InputLVCMOSDDRDifferentialDCLK_A688
D_AP3G19InputLVCMOSDDRDifferentialDCLK_A703
D_AN5F18InputLVCMOSDDRDifferentialDCLK_A686
D_AP5G18InputLVCMOSDDRDifferentialDCLK_A714
D_AN7E18InputLVCMOSDDRDifferentialDCLK_A689
D_AP7D18InputLVCMOSDDRDifferentialDCLK_A705
D_AN9C20InputLVCMOSDDRDifferentialDCLK_A687
D_AP9D20InputLVCMOSDDRDifferentialDCLK_A715
D_AN11B18InputLVCMOSDDRDifferentialDCLK_A715
D_AP11A18InputLVCMOSDDRDifferentialDCLK_A732
D_AN13A20InputLVCMOSDDRDifferentialDCLK_A686
D_AP13B20InputLVCMOSDDRDifferentialDCLK_A715
D_AN15B19InputLVCMOSDDRDifferentialDCLK_A700
D_AP15A19InputLVCMOSDDRDifferentialDCLK_A719
D_BN1K20InputLVCMOSDDRDifferentialDCLK_BInput data bus B (LVDS)716
D_BP1J20InputLVCMOSDDRDifferentialDCLK_B745
D_BN3J19InputLVCMOSDDRDifferentialDCLK_B686
D_BP3K19InputLVCMOSDDRDifferentialDCLK_B703
D_BN5L18InputLVCMOSDDRDifferentialDCLK_B686
D_BP5K18InputLVCMOSDDRDifferentialDCLK_B714
D_BN7M18InputLVCMOSDDRDifferentialDCLK_B693
D_BP7N18InputLVCMOSDDRDifferentialDCLK_B709
D_BN9P20InputLVCMOSDDRDifferentialDCLK_B687
D_BP9N20InputLVCMOSDDRDifferentialDCLK_B715
D_BN11R18InputLVCMOSDDRDifferentialDCLK_B702
D_BP11T18InputLVCMOSDDRDifferentialDCLK_B719
D_BN13T20InputLVCMOSDDRDifferentialDCLK_B686
D_BP13R20InputLVCMOSDDRDifferentialDCLK_B715
D_BN15R19InputLVCMOSDDRDifferentialDCLK_B680
D_BP15T19InputLVCMOSDDRDifferentialDCLK_B700
DCLK_AND19InputLVCMOSDifferentialInput data bus A Clock (LVDS)700
DCLK_APE19InputLVCMOSDifferential728
DCLK_BNN19InputLVCMOSDifferentialInput data bus B Clock (LVDS)700
DCLK_BPM19InputLVCMOSDifferential728
DATA CONTROL INPUTS
SCTRL_ANF20InputLVCMOSDDRDifferentialDCLK_AData Control (LVDS)716
SCTRL_APE20InputLVCMOSDDRDifferentialDCLK_A731
SCTRL_BNL20InputLVCMOSDDRDifferentialDCLK_B707
SCTRL_BPM20InputLVCMOSDDRDifferentialDCLK_B722
SERIAL COMMUNICATION (SCP) AND CONFIGURATION
SCP_CLKA8InputLVCMOSPulldown
SCP_DOA9OutputLVCMOSSCP_CLK
SCP_DIA5InputLVCMOSPulldownSCP_CLK
SCP_ENB7InputLVCMOSPulldownSCP_CLK
PWRDNB9InputLVCMOSPulldown
MICROMIRROR BIAS CLOCKING PULSE
MODE_AA4InputLVCMOSPulldown
MBRST0C3InputAnalogMicromirror Bias Clocking Pulse "MBRST" signals "clock" micromirrors into state of LVCMOS memory cell associated with each mirror.
MBRST1D2InputAnalog
MBRST2D3InputAnalog
MBRST3E2InputAnalog
MBRST4G3InputAnalog
MBRST5E1InputAnalog
MBRST6G2InputAnalog
MBRST7G1InputAnalog
MBRST8N3InputAnalog
MBRST9M2InputAnalog
MBRST10M3InputAnalog
MBRST11L2InputAnalog
MBRST12J3InputAnalog
MBRST13L1InputAnalog
MBRST14J2InputAnalog
MBRST15J1InputAnalog
POWER
VCCB11,B12,B13,B16,R12,R13,R16,R17PowerAnalogPower for LVCMOS Logic
VCCIA12,A14,A16,T12,T14,T16PowerAnalogPower supply for LVDS Interface
VCC2C1,D1,M1,N1PowerAnalogPower for High Voltage CMOS Logic
VSSA6,A11,A13,A15,A17,B4,B5,B8,B14,B15,B17,C2,C18,C19,F1,F2,F19,H1,H2,H3,H18,J18,K1,K2,L19,N2,P18,P19,R4,R9,R14,R15,T7,T13,T15,T17PowerAnalogCommon return for all power inputs
RESERVED SIGNALS (Not for use in system)
RESERVED_R7R7InputLVCMOSPulldownPins should be connected to VSS
RESERVED_R8R8InputLVCMOSPulldown
RESERVED_T8T8InputLVCMOSPulldown
RESERVED_B6B6InputLVCMOSPulldown
NO_CONNECTA3, A7, A10, B2, B3, B10, E3, F3, K3, L3, P1, P2, P3, R1, R2, R3, R5, R6, R10, R11, T1, T2, T3, T4, T5, T6, T9, T10, T11DO NOT CONNECT
The following power supplies are required to operate the DMD: VCC, VCCI, VCC2. VSS must also be connected.
DDR = Double Data Rate. SDR = Single Data Rate. Refer to the Section 6.7 for specifications and relationships.
Refer to Section 6.6 for differential termination specification.
Internal Trace Length (mils) refers to the package electrical trace length.