DLPS101C November   2017  – December 2024 DLP550JE

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Storage Conditions
    3. 5.3  ESD Ratings
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Electrical Characteristics
    7. 5.7  Timing Requirements
    8. 5.8  Window Characteristics
    9. 5.9  System Mounting Interface Loads
    10. 5.10 Micromirror Array Physical Characteristics
    11. 5.11 Micromirror Array Optical Characteristics
    12. 5.12 Chipset Component Usage Specification
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Feature Description
      1. 6.2.1 Power Interface
      2. 6.2.2 Timing
    3. 6.3 Optical Interface and System Image Quality Considerations
      1. 6.3.1 Numerical Aperture and Stray Light Control
      2. 6.3.2 Pupil Match
      3. 6.3.3 Illumination Overfill
    4. 6.4 Micromirror Array Temperature Calculation
      1. 6.4.1 Micromirror Array Temperature Calculation
    5. 6.5 Micromirror Power Density Calculation
    6. 6.6 Micromirror Landed-on/Landed-Off Duty Cycle
      1. 6.6.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 6.6.2 Landed Duty Cycle and Useful Life of the DMD
      3. 6.6.3 Landed Duty Cycle and Operational DMD Temperature
      4. 6.6.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
  9. 8 Power Supply Recommendations
    1. 8.1 DMD Power-Up and Power-Down Procedures
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
      2. 9.1.2 Device Nomenclature
      3. 9.1.3 Device Markings
    2. 9.2 Support Resources
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.1 Related Documentation

The following documents contain additional information related to the chipset components used with the DLP550JE.