DLPS053B October   2014  – October 2016

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  Typical Characteristics
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Micromirror Array Physical Characteristics
    11. 6.11 Micromirror Array Optical Characteristics
    12. 6.12 Window Characteristics
    13. 6.13 Chipset Component Usage Specification
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
    5. 7.5 Window Characteristics and Optics
      1. 7.5.1 Optical Interface and System Image Quality
      2. 7.5.2 Numerical Aperture and Stray Light Control
      3. 7.5.3 Pupil Match
      4. 7.5.4 Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Landed-on/Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
  9. 9 Power Supply Requirements
    1. 9.1 DMD Power Supply Requirements
    2. 9.2 DMD Power Supply Power-Up Procedure
    3. 9.3 DMD Mirror Park Sequence Requirements
      1. 9.3.1 DLPC900
      2. 9.3.2 DLPC910
    4. 9.4 DMD Power Supply Power-Down Procedure
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 General PCB Recommendations
    2. 10.2 Layout Example
      1. 10.2.1 Board Stack and Impedance Requirements
        1. 10.2.1.1 Power Planes
        2. 10.2.1.2 LVDS Signals
        3. 10.2.1.3 Critical Signals
        4. 10.2.1.4 Device Placement
        5. 10.2.1.5 Device Orientation
        6. 10.2.1.6 Fiducials
  11. 11Device Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
      2. 11.1.2 Device Markings
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • FYE|350
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • High Resolution 1080p (1920x1080) Array With
    > 2 Million Micromirrors
    • 0.65-Inch Micromirror Array Diagonal
    • 7.56 μm Micromirror Pitch
    • ± 12° Micromirror Tilt Angle (Relative to Flat State)
    • Designed for Corner Illumination
  • Designed for Use With Broadband Visible Light (420 nm – 700 nm)
    • Window Transmission 97% (Single Pass, Through Two Window Surfaces)
    • Micromirror Reflectivity 88%
    • Array Diffraction Efficiency 86%
    • Array Fill Factor 92%
  • Two 16-Bit, Low Voltage Differential Signaling (LVDS), Double Data Rate (DDR) Input-data Buses
  • Two Dedicated Controller Options at 400 MHz Input Data Clock Rate
  • DLPC900 Digital Controller
    • Up to 9523 Hz (1-Bit Binary Patterns)
    • Up to 19.7 Giga-bits Per Second (1-Bit Binary Patterns)
    • Up to 1031 Hz (8-Bit Gray Patterns Pre-Loaded With Illumination Modulation), External Input Up to 360 Hz
  • DLPC910 Digital Controller
    • Up to 11574 Hz (1-Bit Binary Patterns)
    • Up to 24 Giga-bits Per Second (1-Bit Binary Patterns)
    • Up to 1446 Hz (8-Bit Gray Patterns With Illumination Modulation)
  • Integrated Micromirror Driver Circuitry

2 Applications

  • Industrial
    • 3D Scanners for Machine Vision and Quality Control
    • 3D Printing
    • Direct Imaging Lithography
    • Laser Marking and Repair
  • Medical
    • Ophthalmology
    • 3D Scanners for Limb and Skin Measurement
    • Hyper-spectral Imaging
    • Hyper-spectral Scanning
  • Displays
    • 3D Imaging Microscopes
    • Intelligent and Adaptive Lighting

3 Description

Featuring over 2 million micromirrors, the high resolution 0.65 1080p digital micromirror device (DMD) is a spatial light modulator (SLM) that modulates the amplitude, direction, and/or phase of incoming light. The unique capability offered by the DLP6500 makes it well suited to support a wide variety of industrial, medical, and advanced imaging applications. Reliable function and operation of the DLP6500 requires that it be used in conjunction with the DLPC900 or the DLPC910 digital controllers. This dedicated chipset provides full HD resolution at high speeds and can be easily integrated into a variety of end equipment solutions.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
DLP6500 FYE (350) 35.0 mm × 32.2 mm × 5.1 mm
  1. For all available packages, see the orderable addendum at the end of the datasheet.

DLPC900 Simplified Diagram

DLP6500 DLP6500FYE_typdia.gif

DLPC910 Simplified Diagram

DLP6500 DLPC910_DLP6500FYE_Simp_Schs.gif