DLPS095B November   2017  – November 2024 DLP650LE

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Storage Conditions
    3. 5.3  ESD Ratings
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Electrical Characteristics
    7. 5.7  Capacitance at Recommended Operating Conditions
    8. 5.8  Timing Requirements
    9. 5.9  Window Characteristics
    10. 5.10 System Mounting Interface Loads
    11. 5.11 Micromirror Array Physical Characteristics
    12. 5.12 Micromirror Array Optical Characteristics
    13. 5.13 Chipset Component Usage Specification
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power Interface
      2. 6.3.2 Timing
    4. 6.4 Device Functional Modes
    5. 6.5 Optical Interface and System Image Quality Considerations
      1. 6.5.1 Numerical Aperture and Stray Light Control
      2. 6.5.2 Pupil Match
      3. 6.5.3 Illumination Overfill
    6. 6.6 Micromirror Array Temperature Calculation
    7. 6.7 Micromirror Power Density Calculation
    8. 6.8 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 6.8.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 6.8.2 Landed Duty Cycle and Useful Life of the DMD
      3. 6.8.3 Landed Duty Cycle and Operational DMD Temperature
      4. 6.8.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
  9. 8 Power Supply Recommendations
    1. 8.1 DMD Power Supply Power-Up Procedure
    2. 8.2 DMD Power Supply Power-Down Procedure
  10. 9 Device and Documentation Support
    1. 9.1 Third-Party Products Disclaimer
    2. 9.2 Device Support
      1. 9.2.1 Device Nomenclature
      2. 9.2.2 Device Markings
    3. 9.3 Documentation Support
      1. 9.3.1 Related Documentation
    4. 9.4 Receiving Notification of Documentation Updates
    5. 9.5 Support Resources
    6. 9.6 Trademarks
    7. 9.7 Electrostatic Discharge Caution
    8. 9.8 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2 DMD Power Supply Power-Down Procedure

  • During power-down, VCC and VCCI must be supplied until after VOFFSET are discharged to within the specified limit of ground. Refer to Section 5.4.
  • Power supply slew rates during power-down are flexible, provided that the transient voltage levels follow the requirements specified in Section 5.1 and Section 5.4.
  • During power-down, LVCMOS input pins must be less than specified in Section 5.4.
DLP650LE Power Supply Timing(1)
A. See Pin Configuration and Functions for pin functions.
B. VCC must be up and stable prior to VOFFSET powering up.
C. PWRDNZ has two turn on options. Option 1: PWRDNZ does not go high until VCC and VOFFSET are up and stable, or Option 2: PWRDNZ must be pulsed low for a minimum of TPWRDNZ, or 10ns after VCC and VOFFSET are up and stable.
D. There is a minimum of TLVDS_ARSTZ, or 2μs, wait time from PWRDNZ going high for the LVDS receiver to recover.
E. After the DMD micromirror park sequence is complete, the DLP controller software initiates a hardware power-down that activates the PWRDNZ and disables VOFFSET.
F. Under power-loss conditions, where emergency DMD micromirror park procedures are being enacted by the DLP controller hardware, PWRDNZ goes low.
G. VCC must remain high until after VOFFSET goes low.
H. To prevent excess current, the supply voltage delta |VCCI – VCC| must be less than specified limit in the recommended operating conditions.
Figure 8-1 Power Supply Timing(1)