DLPS186A March   2021  – May 2022 DLP650TE

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5.     11
    6. 6.5  Thermal Information
    7. 6.6  Electrical Characteristics
    8. 6.7  Switching Characteristics
    9.     15
    10. 6.8  Timing Requirements
    11.     17
    12. 6.9  System Mounting Interface Loads
    13.     19
    14. 6.10 Micromirror Array Physical Characteristics
    15.     21
    16. 6.11 Micromirror Array Optical Characteristics
    17.     23
    18. 6.12 Window Characteristics
    19. 6.13 Chipset Component Usage Specification
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Interface
      2. 7.3.2 Timing
    4. 7.4 Device Functional Modes
    5. 7.5 Optical Interface and System Image Quality Considerations
      1. 7.5.1 Numerical Aperture and Stray Light Control
      2. 7.5.2 Pupil Match
      3. 7.5.3 Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Temperature Sensor Diode
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Sequence Requirements
    2. 9.2 DMD Power Supply Power-Up Procedure
    3. 9.3 DMD Power Supply Power-Down Procedure
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Impedance Requirements
    3. 10.3 Layers
    4. 10.4 Trace Width, Spacing
    5. 10.5 Power
    6. 10.6 Trace Length Matching Recommendations
  11. 11Device and Documentation Support
    1. 11.1 Third-Party Products Disclaimer
    2. 11.2 Device Support
      1. 11.2.1 Device Nomenclature
      2. 11.2.2 Device Markings
    3. 11.3 Documentation Support
      1. 11.3.1 Related Documentation
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device is not implied at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure above or below the Recommended Operating Conditions for extended periods may affect device reliability.
Parameter Name Description MIN MAX UNIT
Supply Voltage
VDD Supply voltage for LVCMOS core logic and LVCMOS low speed interface (LSIF) (1) –0.5 2.3 V
VDDA Supply voltage for high speed serial interface (HSSI) receivers (1) –0.3 2.2 V
VOFFSET Supply voltage for HVCMOS and micromirror electrode (1)(2) –0.5 11 V
VBIAS Supply voltage for micromirror electrode (1) –0.5 17 V
VRESET Supply voltage for micromirror electrode (1) –13 0.5 V
| VDDA – VDD | Supply voltage delta (absolute value) (3) 0.3 V
| VBIAS – VOFFSET | Supply voltage delta (absolute value) (4) 11 V
| VBIAS – VRESET | Supply voltage delta (absolute value) (5) 30 V
Input Voltage
Input voltage for other inputs – LSIF and LVCMOS (1) –0.5 2.45 V
Input voltage for other inputs – HSSI (1)(6) –0.2 VDDA V
Low speed interface (LSIF)
fCLOCK LSIF clock frequency (LS_CLK) 130 MHz
| VID | LSIF differential input voltage magnitude (6) 810 mV
IID LSIF differential input current(7) 10 mA
High speed serial interface (HSSI)
fCLOCK HSSI clock frequency (DCLK) 1.65 GHz
| VID | HSSI differential input voltage magnitude Data Lane (6) 700 mV
| VID | HSSI differential input voltage magnitude Clock Lane (6) 700 mV
Environmental
TARRAY Temperature, operating(8) 0 90 °C
TARRAY Temperature, non-operating(8) –40 90 °C
TDP Dew point temperature, operating and non-operating (non-condensing) 81 ºC
(1) All voltage values are with respect to the ground terminals (VSS). The following required power supplies must be connected for proper DMD operation: VDD, VDDA, VOFFSET, VBIAS, and VRESET. All VSS connections are also required.
(2) VOFFSET supply transients must fall within specified voltages.
(3) Exceeding the recommended allowable absolute voltage difference between VDDA and VDD may result in excessive current draw.
(4) Exceeding the recommended allowable absolute voltage difference between VBIAS and VOFFSET may result in excessive current draw.
(5) Exceeding the recommended allowable absolute voltage difference between VBIAS and VRESET may result in excessive current draw.
(6) This maximum input voltage rating applies when each input of a differential pair is at the same voltage potential. LVDS and HSSI differential inputs must not exceed the specified limit or damage may result to the internal termination resistors.
(7) Differential inputs must not exceed the specified limit or damage may result to the internal termination resistors. Specification applies to both the High speed serial interface (HSSI) and the low speed interface (LSI).
(8) The array temperature cannot be measured directly and must be computed analytically from the temperature measured at test point (TP1) shown in Figure 7-1  and the package thermal resistances using the Micromirror Array Temperature Calculation.