DLPS163D April 2019 – December 2023 DLP660TE
PRODUCTION DATA
The layer stack-up and copper weight for each layer is shown in Table 9-1. Small sub-planes are allowed on signal routing layers to connect components to major sub-planes on top or bottom layers if necessary.
LAYER NO. | LAYER NAME | COPPER WT. (oz.) | COMMENTS |
---|---|---|---|
1 | Side A - DMD only | 1.5 | DMD, escapes, low frequency signals, power sub-planes. |
2 | Ground | 1 | Solid ground plane (net GND). |
3 | Signal | 0.5 | 50 Ω and 100 Ω differential signals |
4 | Ground | 1 | Solid ground plane (net GND) |
5 | DMD_P3P3V | 1 | +3.3-V power plane (net DMD_P3P3V) |
6 | Signal | 0.5 | 50 Ω and 100 Ω differential signals |
7 | Ground | 1 | Solid ground plane (net GND). |
8 | Side B - All other Components | 1.5 | Discrete components, low frequency signals, power sub-planes |