DLPS163D
April 2019 – December 2023
DLP660TE
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
4.1
Pin Functions—Test Pads
5
Specifications
5.1
Absolute Maximum Ratings
5.2
Storage Conditions
5.3
ESD Ratings
5.4
Recommended Operating Conditions
5.5
Thermal Information
5.6
Electrical Characteristics
5.7
Capacitance at Recommended Operating Conditions
5.8
Timing Requirements
5.9
System Mounting Interface Loads
5.10
Micromirror Array Physical Characteristics
5.11
Micromirror Array Optical Characteristics
5.12
Window Characteristics
5.13
Chipset Component Usage Specification
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
Power Interface
6.3.2
Timing
6.4
Device Functional Modes
6.5
Optical Interface and System Image Quality Considerations
6.5.1
Optical Interface and System Image Quality
6.5.1.1
Numerical Aperture and Stray Light Control
6.5.1.2
Pupil Match
6.5.1.3
Illumination Overfill
6.6
Micromirror Array Temperature Calculation
6.7
Micromirror Power Density Calculation
6.8
Micromirror Landed-On/Landed-Off Duty Cycle
6.8.1
Definition of Micromirror Landed-On/Landed-Off Duty Cycle
6.8.2
Landed Duty Cycle and Useful Life of the DMD
6.8.3
Landed Duty Cycle and Operational DMD Temperature
6.8.4
Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
7
Application and Implementation
7.1
Application Information
7.2
Typical Application
7.2.1
Design Requirements
7.2.2
Detailed Design Procedure
7.2.3
Application Curves
7.3
DMD Die Temperature Sensing
8
Power Supply Recommendations
8.1
DMD Power Supply Power-Up Procedure
8.2
DMD Power Supply Power-Down Procedure
9
Layout
9.1
Layout Guidelines
9.2
Layout Example
9.2.1
Layers
9.2.2
Impedance Requirements
9.2.3
Trace Width, Spacing
9.2.3.1
Voltage Signals
10
Device and Documentation Support
10.1
Third-Party Products Disclaimer
10.2
Device Support
10.2.1
Device Nomenclature
10.2.2
Device Markings
10.3
Documentation Support
10.3.1
Related Documentation
10.4
Receiving Notification of Documentation Updates
10.5
Support Resources
10.6
Trademarks
10.7
Electrostatic Discharge Caution
10.8
Glossary
11
Revision History
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
FYG|350
MCPS002
Thermal pad, mechanical data (Package|Pins)
Orderable Information
dlps163d_oa
dlps163d_pm
9.2
Layout Example