DLPS188B September   2021  – March 2024 DLP780NE

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Storage Conditions
    3. 5.3  ESD Ratings
    4. 5.4  Recommended Operating Conditions
    5.     11
    6. 5.5  Thermal Information
    7. 5.6  Electrical Characteristics
    8. 5.7  Timing Requirements
    9.     15
    10. 5.8  System Mounting Interface Loads
    11.     17
    12. 5.9  Micromirror Array Physical Characteristics
    13.     19
    14. 5.10 Micromirror Array Optical Characteristics
    15.     21
    16. 5.11 Window Characteristics
    17. 5.12 Chipset Component Usage Specification
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power Interface
      2. 6.3.2 Timing
    4. 6.4 Device Functional Modes
    5. 6.5 Optical Interface and System Image Quality Considerations
      1. 6.5.1 Numerical Aperture and Stray Light Control
      2. 6.5.2 Pupil Match
      3. 6.5.3 Illumination Overfill
    6. 6.6 Micromirror Array Temperature Calculation
    7. 6.7 Micromirror Power Density Calculation
    8. 6.8 Window Aperture Illumination Overfill Calculation
    9. 6.9 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 6.9.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 6.9.2 Landed Duty Cycle and Useful Life of the DMD
      3. 6.9.3 Landed Duty Cycle and Operational DMD Temperature
      4. 6.9.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Temperature Sensor Diode
  9. 8 Power Supply Recommendations
    1. 8.1 DMD Power Supply Requirements
    2. 8.2 DMD Power Supply Power-Up Procedure
    3. 8.3 DMD Power Supply Power-Down Procedure
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
      1. 9.2.1 Layers
      2. 9.2.2 Impedance Requirements
      3. 9.2.3 Trace Width, Spacing
        1. 9.2.3.1 Voltage Signals
  11. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Device Support
      1. 10.2.1 Device Nomenclature
    3. 10.3 Device Markings
    4. 10.4 Documentation Support
      1. 10.4.1 Related Documentation
    5. 10.5 Receiving Notification of Documentation Updates
    6. 10.6 Support Resources
    7. 10.7 Trademarks
    8. 10.8 Electrostatic Discharge Caution
    9. 10.9 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.3.1 Voltage Signals

Table 9-3 Special Trace Widths, Spacing Requirements
SIGNAL NAMEMINIMUM TRACE WIDTH TO PINS (MIL)LAYOUT REQUIREMENT
GND15Maximize trace width to connecting pin
3.3-V Supply Rail15Maximize trace width to connecting pin
VDD, VDDI15Maximize trace width to connecting pin
MBRST(0,14)15Use 10mil etch to connect all signals/voltages from DLPA300 to DLP780NE
VCC215Create mini plane from Voltage regulator to DLP780NE