DLPS243B
October 2022 – September 2023
DLP801XE
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
Storage Conditions
6.3
ESD Ratings
6.4
Recommended Operating Conditions
12
6.5
Thermal Information
6.6
Electrical Characteristics
6.7
Timing Requirements
16
6.8
System Mounting Interface Loads
18
6.9
Micromirror Array Physical Characteristics
20
6.10
Micromirror Array Optical Characteristics
22
6.11
Window Characteristics
6.12
Chipset Component Usage Specification
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Power Interface
7.3.2
Timing
7.4
Device Functional Modes
7.5
Optical Interface and System Image Quality Considerations
7.5.1
Numerical Aperture and Stray Light Control
7.5.2
Pupil Match
7.5.3
Illumination Overfill
7.6
Micromirror Array Temperature Calculation
7.7
Micromirror Power Density Calculation
7.8
Window Aperture Illumination Overfill Calculation
7.9
Micromirror Landed-On/Landed-Off Duty Cycle
7.9.1
Definition of Micromirror Landed-On/Landed-Off Duty Cycle
7.9.2
Landed Duty Cycle and Useful Life of the DMD
7.9.3
Landed Duty Cycle and Operational DMD Temperature
7.9.4
Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curve
8.3
Temperature Sensor Diode
9
Power Supply Recommendations
9.1
DMD Power Supply Requirements
9.2
DMD Power Supply Power-Up Procedure
9.3
DMD Power Supply Power-Down Procedure
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
10.2.1
Layers
10.2.2
Impedance Requirements
10.2.3
Trace Width, Spacing
10.2.3.1
Voltage Signals
11
Device and Documentation Support
11.1
Third-Party Products Disclaimer
11.2
Device Support
11.2.1
Device Nomenclature
11.3
Device Markings
11.4
Documentation Support
11.4.1
Related Documentation
11.5
Receiving Notification of Documentation Updates
11.6
Support Resources
11.7
Trademarks
11.8
Electrostatic Discharge Caution
11.9
Glossary
12
Mechanical, Packaging, and Orderable Information
12.1
Package Option Addendum
Package Options
Mechanical Data (Package|Pins)
FYV|350
MCCC010
Thermal pad, mechanical data (Package|Pins)
Data Sheet
DLP801XE 0.8 4K+ Digital Micromirror Device