DLPS015G april   2010  – june 2023 DLPA200

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Configurations Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics Control Logic
    6. 7.6  5-V Linear Regulator
    7. 7.7  Bias Voltage Boost Converter
    8. 7.8  Reset Voltage Buck-Boost Converter
    9. 7.9  VOFFSET/DMDVCC2 Regulator
    10. 7.10 Switching Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 5-V Linear Regulator
      2. 8.3.2 Bias Voltage Boost Converter
      3. 8.3.3 Reset Voltage Buck-Boost Converter
      4. 8.3.4 VOFFSET/DMDVCC2 Regulator
      5. 8.3.5 Serial Communications Port (SCP)
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Component Selection Guidelines
  11. 10Power Supply Recommendations
    1. 10.1 Power Supply Rail Guidelines
  12. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Grounding Guidelines
    2. 11.2 Thermal Considerations
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.2 ESD Ratings

VALUEUNIT
V(ESD)(1)Electrostatic dischargeHuman body model (HBM)(2)±2000V
Charged device model (CDM)(3)800
(1) Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges in to the device.
(2) JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process.
(3) JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process.