DLPS043B June   2014  – February 2018 DLPA2000

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1. 3.1 Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Storage Conditions
    3. 6.3 ESD Ratings
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Motor Driver Timing Requirements
    8. 6.8 Data Transmission Timing Requirements
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  DMD Regulators
      2. 7.3.2  RGB Strobe Decoder
      3. 7.3.3  LED Current Control
      4. 7.3.4  Calculating Inductor Peak Current
      5. 7.3.5  LED Current Accuracy
      6. 7.3.6  Transient Current Limiting
      7. 7.3.7  1.1-V Regulator (Buck Converter)
      8. 7.3.8  Motor Driver
        1. 7.3.8.1 Motor Driver Overcurrent Protection
      9. 7.3.9  Measurement System
      10. 7.3.10 Protection Circuits
        1. 7.3.10.1 Thermal Warning (HOT) and Thermal Shutdown (TSD)
        2. 7.3.10.2 Low Battery Warning (BAT_LOW) and Undervoltage Lockout (UVLO)
        3. 7.3.10.3 DMD Regulator Fault (DMD_FLT)
        4. 7.3.10.4 V6V Power-Good (V6V_PGF) Fault
        5. 7.3.10.5 VLED Overvoltage (VLED_OVP) Fault
        6. 7.3.10.6 VLED Power Save Mode
        7. 7.3.10.7 V1V8 PG Failure
        8. 7.3.10.8 Interrupt Pin (INTZ)
        9. 7.3.10.9 SPI
      11. 7.3.11 Password Protected Registers
    4. 7.4 Device Functional Modes
    5. 7.5 Register Maps
      1. Table 7. Register Description
      2. 7.5.1     Chip Revision Register
        1. Table 8. Chip Revision Register Field Descriptions
      3. 7.5.2     Enable Register
        1. Table 9. Enable Register Field Descriptions
      4. 7.5.3     Transient-Current Limit Settings
        1. Table 10. Transient-Current Limit Settings Field Descriptions
      5. 7.5.4     Regulation Current MSB, SW4
        1. Table 11. Regulation Current MSB, SW4 Field Descriptions
      6. 7.5.5     Regulation Current LSB, SW4
        1. Table 12. Regulation Current LSB, SW4 Field Descriptions
        2. Table 13. Regulation Current LSB, SW4 Bit Definitions
      7. 7.5.6     Regulation Current MSB, SW5
        1. Table 14. Regulation Current MSB, SW5 Field Descriptions
      8. 7.5.7     Regulation Current LSB, SW5
        1. Table 15. Regulation Current LSB, SW5 Field Descriptions
        2. Table 16. Regulation Current LSB, SW5 Bit Definitions
      9. 7.5.8     Regulation Current MSB, SW6
        1. Table 17. Regulation Current MSB, SW6 Field Descriptions
      10. 7.5.9     Regulation Current LSB, SW6
        1. Table 18. Regulation Current LSB, SW6 Field Descriptions
        2. Table 19. Regulation Current LSB, SW6 Bit Definitions
      11. 7.5.10    Switch On/Off Control (Direct Mode)
        1. Table 20. Switch On/Off Control (Direct Mode) Field Descriptions
      12. 7.5.11    AFE (MUX) Control
        1. Table 21. AFE (MUX) Control Field Descriptions
      13. 7.5.12    Break Before Make (BBM) Timing
        1. Table 22. BBM Timing Field Descriptions
      14. 7.5.13    Interrupt Register
        1. Table 23. Interrupt Register Field Descriptions
      15. 7.5.14    Interrupt Mask Register
        1. Table 24. Interrupt Mask Register Field Descriptions
      16. 7.5.15    Timing Register VOFS, VBIAS, VRST, and RESETZ
        1. Table 25. Timing Register VOFS, VBIAS, VRST, and RESETZ Field Descriptions
        2. Table 26. Timing Register VOFS, VBIAS, VRST, and RESETZ Bit Definitions
      17. 7.5.16    Motor Control Register
        1. Table 27. Motor Control Register Field Descriptions
      18. 7.5.17    Password Register
        1. Table 28. Password Register Field Descriptions
      19. 7.5.18    System Configuration Register
        1. Table 29. System Configuration Register Field Descriptions
      20. 7.5.19    User EEPROM, BYTE0
        1. Table 30. User EEPROM, BYTE0 Field Descriptions
      21. 7.5.20    User EEPROM, BYTE1
        1. Table 31. User EEPROM, BYTE1 Field Descriptions
      22. 7.5.21    User EEPROM, BYTE2
        1. Table 32. User EEPROM, BYTE2 Field Descriptions
      23. 7.5.22    User EEPROM, BYTE3
        1. Table 33. User EEPROM, BYTE3 Field Descriptions
      24. 7.5.23    User EEPROM, BYTE4
        1. Table 34. User EEPROM, BYTE4 Field Descriptions
      25. 7.5.24    User EEPROM, BYTE5
        1. Table 35. User EEPROM, BYTE5 Field Descriptions
      26. 7.5.25    User EEPROM, BYTE6
        1. Table 36. User EEPROM, BYTE6 Field Descriptions
      27. 7.5.26    User EEPROM, BYTE7
        1. Table 37. User EEPROM, BYTE7 Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Projector Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Typical Mobile Sensing Application
      1. 8.3.1 Design Requirements
      2. 8.3.2 Detailed Design Procedure
        1. 8.3.2.1 Dlpc150 System Interfaces
          1. 8.3.2.1.1 Control Interface
      3. 8.3.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Related Links
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Device Functional Modes

Table 5. Modes of Operation

MODEDESCRIPTION
OFF This is the lowest-power mode of operation. All power functions are turned off, registers are reset to their default values, and the IC does not respond to SPI commands. RESETZ pin is pulled low. The IC will enter OFF mode whenever the PROJ_ON pin is low.
STANDBY The DMD regulators and LED power (VLED) are turned off, but the IC does respond to the SPI. The device enters STANDBY mode whenever PROJ_ON is set high or DMD_EN(1) bit is set to 0 using the SPI interface after PROJ_ON is already high. The device also enters STANDBY mode when a fault condition is detected(2). (See Protection Circuits).
ACTIVE1 The DMD supplies are enabled but LED power (VLED) is disabled. PROJ_ON pin must be high, DMD_EN bit must be set to 1, and VLED_EN(3) bit is set to 0.
ACTIVE2 DMD supplies and LED power are enabled. PROJ_ON pin must be high and DMD_EN and VLED_EN bits must both be set to 1.
(1) Settings can be done through Reg01h [9] and Reg2E [119].
(2) Power-good faults, over-voltage, overtemperature shutdown, and undervoltage lockout.
(3) Settings can be done through Reg47h [60], bit is named VLED_EN_SET.

Table 6. Device State as a Function of Control-Pin Status

PROJ_ON PINSTATE
LOW OFF
HIGH STANDBY
ACTIVE1
ACTIVE2
(Device state depends on DMD_EN and VLED_EN bits and whether there are any fault conditions.)
DLPA2000 state_diagram_LPS043.gif
A. || = OR, & = AND.
B. FAULT = Undervoltage on any supply (except LS_OUT), thermal shutdown, or UVLO detection.
C. UVLO detection, per the diagram, causes the DLPA2000 to go into the standby state. This is not the lowest power state. If lower power is desired, PROJ_ON should be set low.
D. DMD_EN register bit can be reset or set by SPI writes. DMD_EN defaults to 0 when PROJ_ON goes from low to high and then the DPP ASIC software automatically sets it to 1. Also, FAULT = 1 causes the DMD_EN register bit to be reset.
E. PWR_EN is a signal internal to the PAD200x. This signal turns on the VCORE regulator and the load switch that drives pin LS_OUT.
Figure 14. State Diagram