DLPS043B
June 2014 – February 2018
DLPA2000
PRODUCTION DATA.
1
Features
2
Applications
3
Description
Device Images
3.1
Simplified Schematic
4
Revision History
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
Storage Conditions
6.3
ESD Ratings
6.4
Recommended Operating Conditions
6.5
Thermal Information
6.6
Electrical Characteristics
6.7
Motor Driver Timing Requirements
6.8
Data Transmission Timing Requirements
6.9
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
DMD Regulators
7.3.2
RGB Strobe Decoder
7.3.3
LED Current Control
7.3.4
Calculating Inductor Peak Current
7.3.5
LED Current Accuracy
7.3.6
Transient Current Limiting
7.3.7
1.1-V Regulator (Buck Converter)
7.3.8
Motor Driver
7.3.8.1
Motor Driver Overcurrent Protection
7.3.9
Measurement System
7.3.10
Protection Circuits
7.3.10.1
Thermal Warning (HOT) and Thermal Shutdown (TSD)
7.3.10.2
Low Battery Warning (BAT_LOW) and Undervoltage Lockout (UVLO)
7.3.10.3
DMD Regulator Fault (DMD_FLT)
7.3.10.4
V6V Power-Good (V6V_PGF) Fault
7.3.10.5
VLED Overvoltage (VLED_OVP) Fault
7.3.10.6
VLED Power Save Mode
7.3.10.7
V1V8 PG Failure
7.3.10.8
Interrupt Pin (INTZ)
7.3.10.9
SPI
7.3.11
Password Protected Registers
7.4
Device Functional Modes
7.5
Register Maps
Table 7.
Register Description
7.5.1
Chip Revision Register
Table 8.
Chip Revision Register Field Descriptions
7.5.2
Enable Register
Table 9.
Enable Register Field Descriptions
7.5.3
Transient-Current Limit Settings
Table 10.
Transient-Current Limit Settings Field Descriptions
7.5.4
Regulation Current MSB, SW4
Table 11.
Regulation Current MSB, SW4 Field Descriptions
7.5.5
Regulation Current LSB, SW4
Table 12.
Regulation Current LSB, SW4 Field Descriptions
Table 13.
Regulation Current LSB, SW4 Bit Definitions
7.5.6
Regulation Current MSB, SW5
Table 14.
Regulation Current MSB, SW5 Field Descriptions
7.5.7
Regulation Current LSB, SW5
Table 15.
Regulation Current LSB, SW5 Field Descriptions
Table 16.
Regulation Current LSB, SW5 Bit Definitions
7.5.8
Regulation Current MSB, SW6
Table 17.
Regulation Current MSB, SW6 Field Descriptions
7.5.9
Regulation Current LSB, SW6
Table 18.
Regulation Current LSB, SW6 Field Descriptions
Table 19.
Regulation Current LSB, SW6 Bit Definitions
7.5.10
Switch On/Off Control (Direct Mode)
Table 20.
Switch On/Off Control (Direct Mode) Field Descriptions
7.5.11
AFE (MUX) Control
Table 21.
AFE (MUX) Control Field Descriptions
7.5.12
Break Before Make (BBM) Timing
Table 22.
BBM Timing Field Descriptions
7.5.13
Interrupt Register
Table 23.
Interrupt Register Field Descriptions
7.5.14
Interrupt Mask Register
Table 24.
Interrupt Mask Register Field Descriptions
7.5.15
Timing Register VOFS, VBIAS, VRST, and RESETZ
Table 25.
Timing Register VOFS, VBIAS, VRST, and RESETZ Field Descriptions
Table 26.
Timing Register VOFS, VBIAS, VRST, and RESETZ Bit Definitions
7.5.16
Motor Control Register
Table 27.
Motor Control Register Field Descriptions
7.5.17
Password Register
Table 28.
Password Register Field Descriptions
7.5.18
System Configuration Register
Table 29.
System Configuration Register Field Descriptions
7.5.19
User EEPROM, BYTE0
Table 30.
User EEPROM, BYTE0 Field Descriptions
7.5.20
User EEPROM, BYTE1
Table 31.
User EEPROM, BYTE1 Field Descriptions
7.5.21
User EEPROM, BYTE2
Table 32.
User EEPROM, BYTE2 Field Descriptions
7.5.22
User EEPROM, BYTE3
Table 33.
User EEPROM, BYTE3 Field Descriptions
7.5.23
User EEPROM, BYTE4
Table 34.
User EEPROM, BYTE4 Field Descriptions
7.5.24
User EEPROM, BYTE5
Table 35.
User EEPROM, BYTE5 Field Descriptions
7.5.25
User EEPROM, BYTE6
Table 36.
User EEPROM, BYTE6 Field Descriptions
7.5.26
User EEPROM, BYTE7
Table 37.
User EEPROM, BYTE7 Field Descriptions
8
Application and Implementation
8.1
Application Information
8.2
Typical Projector Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curve
8.3
Typical Mobile Sensing Application
8.3.1
Design Requirements
8.3.2
Detailed Design Procedure
8.3.2.1
Dlpc150 System Interfaces
8.3.2.1.1
Control Interface
8.3.3
Application Curve
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
Device and Documentation Support
11.1
Device Support
11.1.1
Device Nomenclature
11.2
Related Links
11.3
Community Resources
11.4
Trademarks
11.5
Electrostatic Discharge Caution
11.6
Glossary
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
YFF|56
MXBG330
Thermal pad, mechanical data (Package|Pins)
Orderable Information
dlps043b_oa
dlps043b_pm
11.1.1
Device Nomenclature
Figure 46.
DLPA2000 Package Marking(Top View)