6.5 Thermal Information
THERMAL METRIC(1) | DLPA2000 | UNIT |
YFF (DSBGA) |
| 56 PINS | |
RθJA |
Junction-to-ambient thermal resistance(2) |
45 |
°C/W |
(1) For more information about traditional and new thermal metrics, see the
IC Package Thermal Metrics application report,
SPRA953.
(2) Estimated when mounted on high K JEDEC board per JESD 51-7 with thickness of 1.6 mm, 4 layers, size of 76.2 mm × 114.3 mm, and 2-oz. copper for top and bottom plane. Actual thermal impedance will depend on PCB used in the application.