DLPS052A October   2015  – September 2023 DLPA3000

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Description (cont.)
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 SPI Timing Parameters
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Supply and Monitoring
        1. 8.3.1.1 Supply
        2. 8.3.1.2 Monitoring
          1. 8.3.1.2.1 Block Faults
          2. 8.3.1.2.2 Low Battery and UVLO
          3. 8.3.1.2.3 Auto LED Turn Off Functionality
          4. 8.3.1.2.4 Thermal Protection
      2. 8.3.2 Illumination
        1. 8.3.2.1 Programmable Gain Block
        2. 8.3.2.2 LDO Illum
        3. 8.3.2.3 Illumination Driver A
        4. 8.3.2.4 RGB Strobe Decoder
          1. 8.3.2.4.1 Break Before Make (BBM)
          2. 8.3.2.4.2 Openloop Voltage
          3. 8.3.2.4.3 Transient Current Limit
        5. 8.3.2.5 Illumination Monitoring
          1. 8.3.2.5.1 Power Good
          2. 8.3.2.5.2 Ratio Metric Overvoltage Protection
        6. 8.3.2.6 Load Current and Supply Voltage
        7. 8.3.2.7 Illumination Driver Plus Power FETS Efficiency
      3. 8.3.3 DMD Supplies
        1. 8.3.3.1 LDO DMD
        2. 8.3.3.2 DMD HV Regulator
          1. 8.3.3.2.1 Power-Up and Power-Down Timing
        3. 8.3.3.3 DMD/DLPC Buck Converters
        4. 8.3.3.4 DMD Monitoring
          1. 8.3.3.4.1 Power Good
          2. 8.3.3.4.2 Overvoltage Fault
      4. 8.3.4 Buck Converters
        1. 8.3.4.1 LDO Bucks
        2. 8.3.4.2 General Purpose Buck Converters
        3. 8.3.4.3 Buck Converter Monitoring
          1. 8.3.4.3.1 Power Good
          2. 8.3.4.3.2 Overvoltage Fault
        4. 8.3.4.4 Buck Converter Efficiency
      5. 8.3.5 Auxiliary LDOs
      6. 8.3.6 Measurement System
      7. 8.3.7 Digital Control
        1. 8.3.7.1 SPI
        2. 8.3.7.2 Interrupt
        3. 8.3.7.3 Fast-Shutdown in Case of Fault
    4. 8.4 Device Functional Modes
    5. 8.5 Register Maps
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Typical Application Setup Using DLPA3000
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Typical Application with DLPA3000 Internal Block Diagram
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 SPI Connections
    4. 11.4 RLIM Routing
    5. 11.5 LED Connection
    6. 11.6 Thermal Considerations
  13. 12Device and Documentation Support
    1. 12.1 Third-Party Products Disclaimer
    2. 12.2 Device Support
      1. 12.2.1 Device Nomenclature
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Support Resources
    6. 12.6 Trademarks
    7. 12.7 Support Resources
    8. 12.8 Electrostatic Discharge Caution
    9. 12.9 Glossary
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.2 ESD Ratings

VALUEUNIT
V(ESD)(1)Electrostatic dischargeHuman-body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(2)±2000V
Charged-device model (CDM), per JEDEC specification JESD22-C101, all pins(3)±500
(1) Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges in to the device.
(2) JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process.
(3) JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process.