DLPS240A
June 2024 – August 2024
DLPA3085
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
SPI Timing Parameters
6
Detailed Description
6.1
Overview
6.2
Functional Block Description
6.3
Feature Description
6.3.1
Supply and Monitoring
6.3.1.1
Supply
6.3.1.2
Monitoring
6.3.1.2.1
Block Faults
6.3.1.2.2
Auto LED Turn-Off Functionality
6.3.1.2.3
Thermal Protection
6.3.2
Illumination
6.3.2.1
Programmable Gain Block
6.3.2.2
LDO Illumination
6.3.2.3
Illumination Driver A
6.3.2.4
RGB Strobe Decoder
6.3.2.4.1
Break Before Make (BBM)
6.3.2.4.2
Openloop Voltage
6.3.2.4.3
Transient Current Limit
6.3.2.5
Illumination Monitoring
6.3.2.5.1
Power Good
6.3.2.5.2
Ratio Metric Overvoltage Protection
6.3.2.6
Illumination Driver Plus Power FETs Efficiency
6.3.3
External Power FET Selection
6.3.3.1
Threshold Voltage
6.3.3.2
Gate Charge and Gate Timing
6.3.3.3
RDS(ON)
6.3.4
DMD Supplies
6.3.4.1
LDO DMD
6.3.4.2
DMD HV Regulator
6.3.4.3
DMD/DLPC Buck Converters
6.3.4.4
DMD Monitoring
6.3.4.4.1
Power Good
6.3.4.4.2
Overvoltage Fault
6.3.5
Buck Converters
6.3.5.1
LDO Bucks
6.3.5.2
General Purpose Buck Converters
6.3.5.3
Buck Converter Monitoring
6.3.5.3.1
Power Good
6.3.5.3.2
Overvoltage Fault
6.3.5.4
Buck Converter Efficiency
6.3.6
Auxiliary LDOs
6.3.7
Measurement System
6.4
Device Functional Modes
6.5
Programming
6.5.1
SPI
6.5.2
Interrupt
6.5.3
Fast-Shutdown in Case of Fault
6.6
Register Maps
7
Application and Implementation
7.1
Application Information
7.2
Typical Application
7.2.1
Design Requirements
7.2.2
Detailed Design Procedure
7.2.2.1
Component Selection for General-Purpose Buck Converter
7.2.3
Application Curve
7.3
System Example With DLPA3085 Internal Block Diagram
8
Power Supply Recommendations
8.1
Power-Up and Power-Down Timing
9
Layout
9.1
Layout Guidelines
9.1.1
SPI Connections
9.1.2
RLIM Routing
9.1.3
LED Connection
9.2
Layout Example
9.3
Thermal Considerations
10
Device and Documentation Support
10.1
Third-Party Products Disclaimer
10.2
Device Support
10.2.1
Device Nomenclature
10.3
Receiving Notification of Documentation Updates
10.4
Support Resources
10.5
Trademarks
10.6
Electrostatic Discharge Caution
10.7
Glossary
11
Revision History
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
PFD|100
MPQF054B
Thermal pad, mechanical data (Package|Pins)
PFD|100
PPTD321
Orderable Information
dlps240a_oa
dlps240a_pm
10.7
Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.