DLPS240A June   2024  – August 2024 DLPA3085

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 SPI Timing Parameters
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Description
    3. 6.3 Feature Description
      1. 6.3.1 Supply and Monitoring
        1. 6.3.1.1 Supply
        2. 6.3.1.2 Monitoring
          1. 6.3.1.2.1 Block Faults
          2. 6.3.1.2.2 Auto LED Turn-Off Functionality
          3. 6.3.1.2.3 Thermal Protection
      2. 6.3.2 Illumination
        1. 6.3.2.1 Programmable Gain Block
        2. 6.3.2.2 LDO Illumination
        3. 6.3.2.3 Illumination Driver A
        4. 6.3.2.4 RGB Strobe Decoder
          1. 6.3.2.4.1 Break Before Make (BBM)
          2. 6.3.2.4.2 Openloop Voltage
          3. 6.3.2.4.3 Transient Current Limit
        5. 6.3.2.5 Illumination Monitoring
          1. 6.3.2.5.1 Power Good
          2. 6.3.2.5.2 Ratio Metric Overvoltage Protection
        6. 6.3.2.6 Illumination Driver Plus Power FETs Efficiency
      3. 6.3.3 External Power FET Selection
        1. 6.3.3.1 Threshold Voltage
        2. 6.3.3.2 Gate Charge and Gate Timing
        3. 6.3.3.3 RDS(ON)
      4. 6.3.4 DMD Supplies
        1. 6.3.4.1 LDO DMD
        2. 6.3.4.2 DMD HV Regulator
        3. 6.3.4.3 DMD/DLPC Buck Converters
        4. 6.3.4.4 DMD Monitoring
          1. 6.3.4.4.1 Power Good
          2. 6.3.4.4.2 Overvoltage Fault
      5. 6.3.5 Buck Converters
        1. 6.3.5.1 LDO Bucks
        2. 6.3.5.2 General Purpose Buck Converters
        3. 6.3.5.3 Buck Converter Monitoring
          1. 6.3.5.3.1 Power Good
          2. 6.3.5.3.2 Overvoltage Fault
        4. 6.3.5.4 Buck Converter Efficiency
      6. 6.3.6 Auxiliary LDOs
      7. 6.3.7 Measurement System
    4. 6.4 Device Functional Modes
    5. 6.5 Programming
      1. 6.5.1 SPI
      2. 6.5.2 Interrupt
      3. 6.5.3 Fast-Shutdown in Case of Fault
    6. 6.6 Register Maps
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Component Selection for General-Purpose Buck Converter
      3. 7.2.3 Application Curve
    3. 7.3 System Example With DLPA3085 Internal Block Diagram
  9. 8 Power Supply Recommendations
    1. 8.1 Power-Up and Power-Down Timing
  10. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 SPI Connections
      2. 9.1.2 RLIM Routing
      3. 9.1.3 LED Connection
    2. 9.2 Layout Example
    3. 9.3 Thermal Considerations
  11. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Device Support
      1. 10.2.1 Device Nomenclature
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2 Layout Example

A layout example of a buck converter is shown in Figure 9-4, illustrating the optimal routing and placement of components around the DLPA3085. This can be used as a reference for a general-purpose buck2 (PWR6). The layout example illustrates the inductor and its accompanying capacitors as close as possible to their corresponding pins using the thickest possible traces. The capacitors use multiple vias to the ground layer to ensure a low resistance path and minimizes the distance between the ground connections of the output capacitors and the ground connections of the buck converter.

DLPA3085 Practical Layout Figure 9-4 Practical Layout

A proper layout requires short traces and separate power grounds to avoid losses from trace resistance and to avoid ground shifting. Use high-quality capacitors with low ESR to keep capacitor losses minimal and to maintain an acceptable voltage ripple at the output.

Use an RC snubber network to avoid EMI that can occur when switching high currents at high frequencies. The EMI may have a higher amplitude and frequency than the switching voltage.