DLPS240A June   2024  – August 2024 DLPA3085

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 SPI Timing Parameters
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Description
    3. 6.3 Feature Description
      1. 6.3.1 Supply and Monitoring
        1. 6.3.1.1 Supply
        2. 6.3.1.2 Monitoring
          1. 6.3.1.2.1 Block Faults
          2. 6.3.1.2.2 Auto LED Turn-Off Functionality
          3. 6.3.1.2.3 Thermal Protection
      2. 6.3.2 Illumination
        1. 6.3.2.1 Programmable Gain Block
        2. 6.3.2.2 LDO Illumination
        3. 6.3.2.3 Illumination Driver A
        4. 6.3.2.4 RGB Strobe Decoder
          1. 6.3.2.4.1 Break Before Make (BBM)
          2. 6.3.2.4.2 Openloop Voltage
          3. 6.3.2.4.3 Transient Current Limit
        5. 6.3.2.5 Illumination Monitoring
          1. 6.3.2.5.1 Power Good
          2. 6.3.2.5.2 Ratio Metric Overvoltage Protection
        6. 6.3.2.6 Illumination Driver Plus Power FETs Efficiency
      3. 6.3.3 External Power FET Selection
        1. 6.3.3.1 Threshold Voltage
        2. 6.3.3.2 Gate Charge and Gate Timing
        3. 6.3.3.3 RDS(ON)
      4. 6.3.4 DMD Supplies
        1. 6.3.4.1 LDO DMD
        2. 6.3.4.2 DMD HV Regulator
        3. 6.3.4.3 DMD/DLPC Buck Converters
        4. 6.3.4.4 DMD Monitoring
          1. 6.3.4.4.1 Power Good
          2. 6.3.4.4.2 Overvoltage Fault
      5. 6.3.5 Buck Converters
        1. 6.3.5.1 LDO Bucks
        2. 6.3.5.2 General Purpose Buck Converters
        3. 6.3.5.3 Buck Converter Monitoring
          1. 6.3.5.3.1 Power Good
          2. 6.3.5.3.2 Overvoltage Fault
        4. 6.3.5.4 Buck Converter Efficiency
      6. 6.3.6 Auxiliary LDOs
      7. 6.3.7 Measurement System
    4. 6.4 Device Functional Modes
    5. 6.5 Programming
      1. 6.5.1 SPI
      2. 6.5.2 Interrupt
      3. 6.5.3 Fast-Shutdown in Case of Fault
    6. 6.6 Register Maps
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Component Selection for General-Purpose Buck Converter
      3. 7.2.3 Application Curve
    3. 7.3 System Example With DLPA3085 Internal Block Diagram
  9. 8 Power Supply Recommendations
    1. 8.1 Power-Up and Power-Down Timing
  10. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 SPI Connections
      2. 9.1.2 RLIM Routing
      3. 9.1.3 LED Connection
    2. 9.2 Layout Example
    3. 9.3 Thermal Considerations
  11. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Device Support
      1. 10.2.1 Device Nomenclature
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.6 SPI Timing Parameters

SPI_VIN = 3.6V ± 5%, TA = 0 to 70°C, CL = 10pF (unless otherwise noted).
MINNOMMAXUNIT
fCLKSerial clock frequency040MHz
tCLKLPulse width low, SPI_CLK, 50% level10ns
tCLKHPulse width high, SPI_CLK, 50% level10ns
ttTransition time, 20% to 80% level, all signals0.24ns
tCSCRSPI_SS_Z falling to SPI_CLK rising, 50% level8ns
tCFCSSPI_CLK falling to SPI_CSZ rising, 50% level1ns
tCDSSPI_MOSI data setup time, 50% level7ns
tCDHSPI_MOSI data hold time, 50% level6ns
tiSSPI_MISO data setup time, 50% level10ns
tiHSPI_MISO data hold time, 50% level0ns
tCFDOSPI_CLK falling to SPI_MISO data valid, 50% level13ns
tCSZSPI_CSZ rising to SPI_MISO HiZ6ns