DLPS096B November   2017  – May 2022 DLPC120-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1. 5.1 LED Driver Interface
    2. 5.2 DMD Temperature Interface
    3.     General Purpose I/O
    4. 5.3 Main Video and Data Control Interface
    5. 5.4 DMD Interface
    6. 5.5 Memory Interface
    7.     Board Level Test and Debug
    8.     Manufacturing Test Support
    9.     Test Point Interface
    10.     Power and Ground
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Electrical Characteristics for I/O
    7. 6.7  Power Supply and Reset Timing Requirements
    8. 6.8  Reference Clock PLL Timing Requirements
    9. 6.9  Parallel Interface General Timing Requirements
    10. 6.10 Parallel Interface Frame Timing Requirements
    11. 6.11 Flash Memory Interface Timing Requirements
    12. 6.12 DMD Interface Timing Requirements
    13. 6.13 JTAG Interface Timing Requirements
    14. 6.14 I2C Interface Timing Requirements
  7. 7 Parameter Measurement Information
    1. 7.1 Parallel Interface Input Source Timing
    2. 7.2 Design for Test Functions
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Serial Flash Interface
      2. 8.3.2 Serial Flash Programming
      3. 8.3.3 DDR2 Memory Interface
      4. 8.3.4 JTAG and DMD Interface Test
      5. 8.3.5 Temperature Monitor Function
      6. 8.3.6 Host Command Interface
    4. 8.4 Device Functional Modes
      1. 8.4.1 External Video Mode
      2. 8.4.2 Splash Screen Mode
      3. 8.4.3 Test Pattern Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Filtering
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB layout guidelines for internal ASIC PLL power
      2. 11.1.2 DLPC120-Q1 Reference Clock
        1. 11.1.2.1 Recommended Crystal Oscillator Configuration
      3. 11.1.3 General PCB Recommendations
      4. 11.1.4 PCB Routing Guidelines
      5. 11.1.5 Number of Layer Changes
      6. 11.1.6 Terminations
      7. 11.1.7 General Handling Guidelines for Unused CMOS-Type Pins
  12. 12Device and Documentation Support
    1. 12.1 Third-Party Products Disclaimer
    2. 12.2 Device Support
      1. 12.2.1 Device Nomenclature
        1. 12.2.1.1 Device Markings
    3. 12.3 Documentation Support
      1. 12.3.1 Related Documentation
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Support Resources
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ZXS|216
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.11 Flash Memory Interface Timing Requirements

MINNOMMAXUNIT
ƒclockClock frequency, FLASH_SCLK(1)39.00MHz
tclkperClock period, FLASH_SCLK50% reference points25.64ns
twhPulse width high, FLASH_SCLK50% reference points10ns
twlPulse width low, FLASH_SCLK50% reference points10ns
ttTransition time, all signals20% to 80% reference points, Cload = 20 pF13ns
tvalid_POCIFlash POCI valid data max delay after FLASH_SCLK falling edge50% reference points10ns
tvalid_PICO_bPICO valid before rising edge of FLASH_SCLK50% reference points2.2ns
tvalid_PICO_aPICO valid after rising edge of FLASH_SCLK50% reference points5.2ns
(1) Spread Spectrum clock modulation, when enabled, will affect the nominal frequency of the FLASH_SCLK.
Figure 6-5 Flash Interface Timing