DLPS048C March   2015  – June 2019 DLPC150

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      DLP 0.2-Inch WVGA Chipset
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
    2. 5.1 DLPC150 Mechanical Data
      1. Table 1. I/O Type Subscript Definition
      2. Table 2. Internal Pullup and Pulldown Characteristics
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics Over Recommended Operating Conditions
    6. 6.6  Electrical Characteristics
    7. 6.7  High-Speed Sub-LVDS Electrical Characteristics
    8. 6.8  Low-Speed SDR Electrical Characteristics
    9. 6.9  System Oscillators Timing Requirements
    10. 6.10 Power-Up and Reset Timing Requirements
    11. 6.11 Parallel Interface Frame Timing Requirements
    12. 6.12 Parallel Interface General Timing Requirements
    13. 6.13 Flash Interface Timing Requirements
  7. 7 Parameter Measurement Information
    1. 7.1 Host_irq Usage Model
    2. 7.2 Input Source
      1. 7.2.1 Parallel Interface Supports Two Data Transfer Formats
        1. 7.2.1.1 Pdata Bus – Parallel Interface Bit Mapping Modes
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Interface Timing Requirements
        1. 8.3.1.1 Parallel Interface
      2. 8.3.2 Serial Flash Interface
      3. 8.3.3 Serial Flash Programming
      4. 8.3.4 I2C Control Interface
      5. 8.3.5 DMD (Sub-LVDS) Interface
      6. 8.3.6 Calibration And Debug Support
      7. 8.3.7 DMD Interface Considerations
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 DLPC150 System Design Consideration – Application Notes
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 DLPC150 System Interfaces
          1. 9.2.2.1.1 Control Interface
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 System Power-Up and Power-Down Sequence
    2. 10.2 DLPC150 Power-Up Initialization Sequence
    3. 10.3 DMD Fast Park Control (PARKZ)
    4. 10.4 Hot Plug Usage
    5. 10.5 Maximum Signal Transition Time
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Layout Guidelines For Internal Controller PLL Power
      2. 11.1.2 DLPC150 Reference Clock
        1. 11.1.2.1 Recommended Crystal Oscillator Configuration
      3. 11.1.3 General PCB Recommendations
      4. 11.1.4 General Handling Guidelines for Unused CMOS-Type Pins
      5. 11.1.5 Maximum Pin-to-Pin, PCB Interconnects Etch Lengths
      6. 11.1.6 Number of Layer Changes
      7. 11.1.7 Stubs
      8. 11.1.8 Terminations
      9. 11.1.9 Routing Vias
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
        1. 12.1.1.1 Device Markings
    2. 12.2 Related Links
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Package Option Addendum
      1. 13.1.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

9.2 Typical Application

A typical embedded system application using the DLPC150 controller and the DLPC2010NIR is shown in Figure 13. In this configuration, the DLPC150 controller supports a 24-bit parallel RGB input, typical of LCD interfaces, from an external source or processor. The DLPC150 controller processes the digital input image and converts the data into the format needed by the DLP2010NIR. The DLP2010NIR steers light by setting specific micromirrors to the "on" position, directing light to the detector, while unwanted micromirrors are set to "off" position, directing light away from the detector. The microprocessor sends binary images to the DLP2010NIR to steer specific wavelengths of light into the detector. The microprocessor uses an analog-to-digital converter to sample the signal received by the detector into a digital value. By sequentially selecting different wavelengths of light and capturing the values at the detector, the microprocessor can then plot a spectral response to the light.

DLPC150 Typical_Application_Blk_Diag.gifFigure 13. Typical Application Diagram