DLPS014F
April 2010 – May 2018
DLPC200
PRODUCTION DATA.
1
Features
2
Applications
3
Description
Device Images
4
Revision History
5
Pin Configuration and Functions
Pin Functions
Power and Ground Pins
6
Specifications
6.1
Absolute Maximum Ratings
6.2
Handling Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
I/O Electrical Characteristics
6.6
Video Input Pixel Interface Timing Requirements
6.7
I2C Interface Timing Requirements
6.8
USB Read Interface Timing Requirements
6.9
USB Write Interface Timing Requirements
6.10
SPI Slave Interface Timing Requirements
6.11
Parallel Flash Interface Timing Requirements
6.12
Serial Flash Interface Timing Requirements
6.13
Static RAM Interface Timing Requirements
6.14
DMD Interface Timing Requirements
6.15
DLPA200 Interface Timing Requirements
6.16
DDR2 SDR Memory Interface Timing Requirements
6.17
Video Input Pixel Interface – Image Sync and Blanking Requirements
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Frame Rates
7.4
Device Functional Modes
7.4.1
Video Modes
7.4.2
Structured Light Modes
7.4.2.1
Static Image Buffer Mode
7.4.2.2
Real Time Structured Light Mode
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
DLPC200 System Interfaces
8.2.2.1.1
DLPC200 Master, I2C Interface for EDID Programming
8.2.2.1.2
USB Interface
8.2.2.1.3
Bus Protocol
8.2.2.1.4
SPI Slave Interface
8.2.2.1.5
Parallel Flash Memory Interface
8.2.2.1.6
Serial Flash Memory Interface
8.2.2.1.7
SRAM Interface
8.2.2.1.8
DDR2 SDR Memory Interface
8.2.2.1.9
Projector Image and Control Port Signals
8.2.2.1.10
SDRAM Memory
8.2.3
Application Curve
9
Power Supply Recommendations
9.1
Power-Up Requirements
9.2
Power-Down Requirements
10
Layout
10.1
Layout Guidelines
10.1.1
Impedance Requirements
10.1.2
PCB Signal Routing
10.1.3
Fiducials
10.2
Layout Example
10.3
Thermal Considerations
10.3.1
Heat Sink
11
Device and Documentation Support
11.1
Device Support
11.1.1
Third-Party Products Disclaimer
11.1.2
Device Marking
11.2
Documentation Support
11.3
Receiving Notification of Documentation Updates
11.4
Community Resources
11.5
Trademarks
11.6
Electrostatic Discharge Caution
11.7
Glossary
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
ZEW|780
MPBG979A
Thermal pad, mechanical data (Package|Pins)
Orderable Information
dlps014f_oa
8.2.2
Detailed Design Procedure