DLPS014F April   2010  – May 2018 DLPC200

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
    2.     Power and Ground Pins
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Handling Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  I/O Electrical Characteristics
    6. 6.6  Video Input Pixel Interface Timing Requirements
    7. 6.7  I2C Interface Timing Requirements
    8. 6.8  USB Read Interface Timing Requirements
    9. 6.9  USB Write Interface Timing Requirements
    10. 6.10 SPI Slave Interface Timing Requirements
    11. 6.11 Parallel Flash Interface Timing Requirements
    12. 6.12 Serial Flash Interface Timing Requirements
    13. 6.13 Static RAM Interface Timing Requirements
    14. 6.14 DMD Interface Timing Requirements
    15. 6.15 DLPA200 Interface Timing Requirements
    16. 6.16 DDR2 SDR Memory Interface Timing Requirements
    17. 6.17 Video Input Pixel Interface – Image Sync and Blanking Requirements
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Frame Rates
    4. 7.4 Device Functional Modes
      1. 7.4.1 Video Modes
      2. 7.4.2 Structured Light Modes
        1. 7.4.2.1 Static Image Buffer Mode
        2. 7.4.2.2 Real Time Structured Light Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 DLPC200 System Interfaces
          1. 8.2.2.1.1  DLPC200 Master, I2C Interface for EDID Programming
          2. 8.2.2.1.2  USB Interface
          3. 8.2.2.1.3  Bus Protocol
          4. 8.2.2.1.4  SPI Slave Interface
          5. 8.2.2.1.5  Parallel Flash Memory Interface
          6. 8.2.2.1.6  Serial Flash Memory Interface
          7. 8.2.2.1.7  SRAM Interface
          8. 8.2.2.1.8  DDR2 SDR Memory Interface
          9. 8.2.2.1.9  Projector Image and Control Port Signals
          10. 8.2.2.1.10 SDRAM Memory
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
    1. 9.1 Power-Up Requirements
    2. 9.2 Power-Down Requirements
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Impedance Requirements
      2. 10.1.2 PCB Signal Routing
      3. 10.1.3 Fiducials
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
      1. 10.3.1 Heat Sink
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Device Marking
    2. 11.2 Documentation Support
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.3.1 Heat Sink

A heat sink not required for operation between 0°C and 55°C ambient, but is required for operation between 55°C and 85°C, TI recommends a low-profile (15-mm) heat sink. See Thermal Information for thermal resistance with different airflow values without a heat sink.