DLPS054I December   2015  – August 2024 DLPC230-Q1 , DLPC231-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Electrical Characteristics for Fixed Voltage I/O
    7. 5.7  DMD High-Speed SubLVDS Electrical Characteristics
    8. 5.8  DMD Low-Speed SubLVDS Electrical Characteristics
    9. 5.9  OpenLDI LVDS Electrical Characteristics
    10. 5.10 Power Dissipation Characterisics
    11. 5.11 System Oscillators Timing Requirements
    12. 5.12 Power Supply and Reset Timing Requirements
    13. 5.13 Parallel Interface General Timing Requirements
    14. 5.14 OpenLDI Interface General Timing Requirements
    15. 5.15 Parallel/OpenLDI Interface Frame Timing Requirements
    16. 5.16 Host/Diagnostic Port SPI Interface Timing Requirements
    17. 5.17 Host/Diagnostic Port I2C Interface Timing Requirements
    18. 5.18 Flash Interface Timing Requirements
    19. 5.19 TPS99000-Q1 SPI Interface Timing Requirements
    20. 5.20 TPS99000-Q1 AD3 Interface Timing Requirements
    21. 5.21 DLPC23x-Q1 I2C Port Interface Timing Requirements
    22. 5.22 Chipset Component Usage Specification
  7. 6 Parameter Measurement Information
    1. 6.1 HOST_IRQ Usage Model
    2. 6.2 Input Source
      1. 6.2.1 Supported Input Sources
      2. 6.2.2 Parallel Interface Supported Data Transfer Formats
        1. 6.2.2.1 OpenLDI Interface Supported Data Transfer Formats
          1. 6.2.2.1.1 OpenLDI Interface Bit Mapping Modes
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Parallel Interface
      2. 7.3.2  OpenLDI Interface
      3. 7.3.3  DMD (SubLVDS) Interface
      4. 7.3.4  Serial Flash Interface
      5. 7.3.5  Serial Flash Programming
      6. 7.3.6  Host Command and Diagnostic Processor Interfaces
      7. 7.3.7  GPIO Supported Functionality
      8. 7.3.8  Built-In Self Test (BIST)
      9. 7.3.9  EEPROMs
      10. 7.3.10 Temperature Sensor
      11. 7.3.11 Debug Support
    4. 7.4 Device Functional Modes
      1. 7.4.1 Standby Mode
      2. 7.4.2 Display Mode
      3. 7.4.3 Calibration Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Head-Up Display
        1. 8.2.1.1 Design Requirements
      2. 8.2.2 Headlight
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Headlight Video Input
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Supply Management
      2. 8.3.2 Hot Plug Usage
      3. 8.3.3 Power Supply Filtering
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1  PCB Layout Guidelines for Internal ASIC PLL Power
        2. 8.4.1.2  DLPC23x-Q1 Reference Clock
          1. 8.4.1.2.1 Recommended Crystal Oscillator Configuration
        3. 8.4.1.3  DMD Interface Layout Considerations
        4. 8.4.1.4  General PCB Recommendations
        5. 8.4.1.5  General Handling Guidelines for Unused CMOS-Type Pins
        6. 8.4.1.6  Maximum Pin-to-Pin, PCB Interconnects Etch Lengths
        7. 8.4.1.7  Number of Layer Changes
        8. 8.4.1.8  Stubs
        9. 8.4.1.9  Terminations
        10. 8.4.1.10 Routing Vias
        11. 8.4.1.11 Layout Examples
      2. 8.4.2 Thermal Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
      2. 9.1.2 Device Nomenclature
        1. 9.1.2.1 Device Markings DLPC230-Q1 or DLPC230S-Q1
        2. 9.1.2.2 Device Markings DLPC231-Q1 or DLPC231S-Q1
        3. 9.1.2.3 Video Timing Parameter Definitions
    2. 9.2 Trademarks
    3. 9.3 Electrostatic Discharge Caution
    4. 9.4 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.20 TPS99000-Q1 AD3 Interface Timing Requirements

The DLPC23x-Q1 ASIC to TPS99000-Q1 AD3 interface is used to retrieve ADC measurements from the TPS99000-Q1. The interface is similar to SPI and includes a clock, MOSI, and MISO signal.
(1)(2)(3)MINMAXUNIT
fclockClock frequency, PMIC_AD3_CLK29.32630.006MHz
tp_clkperClock period, PMIC_AD3_CLK
(50% reference points)		33.32734.100ns
tp_whPulse duration high, PMIC_AD3_CLK
(50% reference points) (Referenced to tp_clkper)		40%
tp_wlPulse duration low, PMIC_AD3_CLK
(50% reference points) (Referenced to tp_clkper)		40%
ttTransition time – all input signals20% to 80% reference points6ns
tp_suSetup time – PMIC_AD3_MISO valid before PMIC_AD3_CLK falling edge
(50% reference points)		14.5ns
tp_hHold time – PMIC_AD3_MISO valid after PMIC_AD3_CLK falling edge
(50% reference points)		0ns
tp_clqvPMIC_AD3_MOSI output delay (valid) time (with respect to falling edge of PMIC_AD3_CLK)
(50% reference points)		–2.02.0ns
(1) PMIC_AD3_MOSI ((DLPC23x-Q1) Output / (TPS99000-Q1) Input) is transmitted on the falling edge of PMIC_AD3_CLK.
(2) PMIC_AD3_MISO ((DLPC23x-Q1) Input / (TPS99000-Q1) Output) is captured on the rising edge of PMIC_AD3_CLK.
(3) PMIC_AD3_CLK is used as the primary TPS99000-Q1 system clock in addition to supporting the AD3 interface.
DLPC230-Q1 DLPC231-Q1 TPS99000-Q1 AD3 Interface TimingFigure 5-11 TPS99000-Q1 AD3 Interface Timing
DLPC230-Q1 DLPC231-Q1 TPS99000-Q1 AD3 Data Capture and TransitionFigure 5-12 TPS99000-Q1 AD3 Data Capture and Transition