DLPS201E August   2020  – August 2024 DLPC230S-Q1 , DLPC231S-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Electrical Characteristics for Fixed Voltage I/O
    7. 5.7  DMD High-Speed SubLVDS Electrical Characteristics
    8. 5.8  DMD Low-Speed SubLVDS Electrical Characteristics
    9. 5.9  OpenLDI LVDS Electrical Characteristics
    10. 5.10 Power Dissipation Characterisics
    11. 5.11 System Oscillators Timing Requirements
    12. 5.12 Power Supply and Reset Timing Requirements
    13. 5.13 Parallel Interface General Timing Requirements
    14. 5.14 OpenLDI Interface General Timing Requirements
    15. 5.15 Parallel/OpenLDI Interface Frame Timing Requirements
    16. 5.16 Host/Diagnostic Port SPI Interface Timing Requirements
    17. 5.17 Host/Diagnostic Port I2C Interface Timing Requirements
    18. 5.18 Flash Interface Timing Requirements
    19. 5.19 TPS99000S-Q1 SPI Interface Timing Requirements
    20. 5.20 TPS99000S-Q1 AD3 Interface Timing Requirements
    21. 5.21 DLPC23xS-Q1 I2C Port Interface Timing Requirements
    22. 5.22 Chipset Component Usage Specification
  7. 6 Parameter Measurement Information
    1. 6.1 HOST_IRQ Usage Model
    2. 6.2 Input Source
      1. 6.2.1 Supported Input Sources
      2. 6.2.2 Parallel Interface Supported Data Transfer Formats
        1. 6.2.2.1 OpenLDI Interface Supported Data Transfer Formats
          1. 6.2.2.1.1 OpenLDI Interface Bit Mapping Modes
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Parallel Interface
      2. 7.3.2  OpenLDI Interface
      3. 7.3.3  DMD (SubLVDS) Interface
      4. 7.3.4  Serial Flash Interface
      5. 7.3.5  Serial Flash Programming
      6. 7.3.6  Host Command and Diagnostic Processor Interfaces
      7. 7.3.7  GPIO Supported Functionality
      8. 7.3.8  Built-In Self Test (BIST)
      9. 7.3.9  EEPROMs
      10. 7.3.10 Temperature Sensor
      11. 7.3.11 Debug Support
    4. 7.4 Device Functional Modes
      1. 7.4.1 Standby Mode
      2. 7.4.2 Display Mode
      3. 7.4.3 Calibration Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Head-Up Display
        1. 8.2.1.1 Design Requirements
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Supply Management
      2. 8.3.2 Hot Plug Usage
      3. 8.3.3 Power Supply Filtering
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1  PCB Layout Guidelines for Internal ASIC PLL Power
        2. 8.4.1.2  DLPC23xS-Q1 Reference Clock
          1. 8.4.1.2.1 Recommended Crystal Oscillator Configuration
        3. 8.4.1.3  DMD Interface Layout Considerations
        4. 8.4.1.4  General PCB Recommendations
        5. 8.4.1.5  General Handling Guidelines for Unused CMOS-Type Pins
        6. 8.4.1.6  Maximum Pin-to-Pin, PCB Interconnects Etch Lengths
        7. 8.4.1.7  Number of Layer Changes
        8. 8.4.1.8  Stubs
        9. 8.4.1.9  Terminations
        10. 8.4.1.10 Routing Vias
      2. 8.4.2 Thermal Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
      2. 9.1.2 Device Nomenclature
        1. 9.1.2.1 Device Markings DLPC230-Q1 or DLPC230S-Q1
        2. 9.1.2.2 Device Markings DLPC231-Q1 or DLPC231S-Q1
        3. 9.1.2.3 Video Timing Parameter Definitions
    2. 9.2 Trademarks
    3. 9.3 Electrostatic Discharge Caution
    4. 9.4 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ZEK|324
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4.1.1 PCB Layout Guidelines for Internal ASIC PLL Power

The following guidelines are recommended to achieve the desired ASIC performance relative to the internal PLL. The DLPC23xS-Q1 contains two internal PLLs that have dedicated analog supplies (VCC11AD_PLLM, GND11AD_PLLM, VCC11AD_PLLD, GND11AD_PLLD). At a minimum, VCC11AD_PLLx power and GND11AD_PLLx ground pins must be isolated using a simple passive filter consisting of two series ferrites and two shunt capacitors (to widen the spectrum of noise absorption). Recommended values and layout are shown in Table 8-1 and Figure 8-10, respectively.

Table 8-1 Recommended PLL Filter Components
COMPONENTPARAMETERRECOMMENDED VALUEUNIT
Shunt CapacitorCapacitance0.1µF
Shunt CapacitorCapacitance1.0µF
Series FerriteImpedance at 100 MHz> 100Ω
DC Resistance< 0.40

Because the PCB layout is critical to PLL performance, it is vital that the quiet ground and power are treated like analog signals. Additional design guidelines are as follows:

  • All four components must be placed as close to the ASIC as possible.
  • It is especially important to keep the leads of the high-frequency capacitors as short as possible.
  • A capacitor of each value must be connected across VCC11AD_PLLM / GND11AD_PLLM and VCC11AD_PLLD / GND11AD_PLLD respectively on the ASIC side of the ferrites.
  • VCC11AD_PLLM and VCC11AD_PLLD must be a single trace from the DLPC23xS-Q1 to both capacitors and then through the series of ferrites to the power source.
  • The power and ground traces must be as short as possible, parallel to each other, and as close as possible to each other.
DLPC230S-Q1 DLPC231S-Q1 DLPC230S-Q1 PLL Filter LayoutFigure 8-10 DLPC230S-Q1 PLL Filter Layout
DLPC230S-Q1 DLPC231S-Q1 DLPC231S-Q1 PLL Filter and Crystal Layout Figure 8-11 DLPC231S-Q1 PLL Filter and Crystal Layout